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Lead the development and integration of advanced packaging and assembly solutions for MEMS-based silicon photonics switching platforms. Bridge the gap between R&D and high-volume manufacturing by managing OSAT partners and optimizing assembly processes.
Requires a degree in Engineering or Materials Science with over 15 years of experience in semiconductor or photonics packaging. Must have proven expertise in NPI, advanced packaging technologies like 2.5D/3D integration, and hands-on experience with assembly tooling.
nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.
We are seeking a Systems Packaging & Assembly Engineer to lead the development and integration of advanced packaging and assembly solutions for our MEMS-based silicon photonics switching platform.
This role sits at the intersection of device engineering, packaging architecture, manufacturing engineering, and supply chain, driving packaging solutions from concept through high-volume production.
The ideal candidate is a hands-on packaging expert with deep experience in optical modules, MEMS devices, semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional programs with OSATs, contract manufacturers, and internal engineering teams.
This is a highly visible role responsible for bridging R&D and manufacturing, ensuring that our packaging architecture enables scalable production of high-performance optical switching systems.
\nKey ResponsibilitiesDefine and codesign package substrates for MEMS-based silicon photonics optical switching systems.
Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces.
Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability.
Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces.
Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration.
Develop and implement fixtures, jigs, and tooling at our OSATs to support prototype builds and NPI.
Establish process flows, BOM structures, and manufacturing documentation for new products.
Identify opportunities for yield improvement, cost reduction, and cycle-time optimization.
Lead New Product Introduction (NPI) activities from prototype builds through production ramp.
Work closely with OSAT partners, contract manufacturers, and suppliers to meet our product requirements.
Drive process qualification, yield ramp, and reliability validation.
Implement root cause analysis (RCA), corrective actions, and failure analysis workflows.
Direct involvement with OSATs, substrate vendors, optics suppliers, and strategic partners.
Lead technology transfer from engineering to manufacturing partners.
Act as a technical program manager for packaging and assembly development across multiple engineering teams.
Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain.
Track program milestones and ensure packaging readiness aligns with product development timelines.
Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
15+ years of experience in semiconductor or photonics packaging engineering.
Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.
Strong background in advanced packaging technologies, such as:
Flip-chip and wirebond hybrid assemblies
Multi-die stacking (2.5D / 3D integration)
System-in-Package (SiP)
Proven experience driving NPI programs from concept to high-volume production.
Hands-on experience working with OSATs and contract manufacturers.
Strong knowledge of yield improvement, failure analysis, and process development.
Demonstrated ability to lead projects and guide engineers as a senior technical contributor.
Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI).
Strong background in materials characterization and statistical process control (DOE, FMEA, SPC)
Experience with fiber attach and photonic IC packaging.
Background in optical transceivers, co-packaged optics, or photonics modules.
Experience with optical modules, photonics packaging, and/or MEMS devices.
Experience with optical alignment and hermetic packaging solutions.
Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks, etc.)
nEye is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.
Transforming the AI Infrastructure with future-proof optical switches
We are nEye.ai, an optical switch startup founded in 2020 to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability. www.neye.ai.
Offices: 4555 Great America Pkwy, Suite 230, Santa Clara, California 95054, US
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