Process Integration Engineer (Phoenix, AZ On-site)
Phoenix, Arizona, United States · On-site
Mid level$15B raised
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Skills: Semiconductor process technology, Process integration, New product introduction, Big data analysis, Yield improvement
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Full-time
bachelor degree, postgraduate degree
Relocation assistance
Posted 12d ago
~40 hrs/week
Responsibilities
The Process Integration Engineer will manage new product qualification, technology transfers, and yield improvement through big data analysis and experimental design. They will collaborate with cross-functional teams to maintain process stability and provide technical solutions to customers in a high-volume manufacturing environment.
Requirements
Applicants must hold a Bachelor's degree or higher in Electrical Engineering, Material Science, or Physics. Candidates are required to have experience in silicon process flow, including FEOL, MEOL, and BEOL, along with strong communication and troubleshooting skills.
Full job description
A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate it’s leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.
TSMC Arizona is seeking a Process Integration Engineer (PIE) for a pivotal role dedicated to ensuring customers achieve success throughout the full lifecycle of their products. This includes New Product Introduction (NPI), device performance, yield, and reliability, leveraging our most advanced technology. Engage your passion for semiconductors and engineering by utilizing cutting-edge, agile, and intelligent operating systems to drive manufacturing excellence. Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or specific requests. Your contributions will be instrumental in achieving exceptional outcomes for our customers.
Job Description:
Your main responsibilities include:
New product qualification and technology transfers from a mother fab.
Big data analysis to identify process design weaknesses and/or manufacturing tool issues.
Designing, executing, and analyzing experiments to improve yield and performance for each specific product.
Collaborating with the engineering teams to maintain process stability and provide technical solutions to customers.
Scheduled night shifts and weekend on-call rotations in a 24/7 high-volume manufacturing environment.
Qualifications:
Applicants must be legally eligible to work in the United States and have:
Bachelor's or higher degree in Electrical Engineering, Material Science or Physics.
Experience in leading the improvement of the silicon process flow Including front-end-of-line (FEOL), middle-end-of-line (MEOL), and back-end-of-line (BEOL)
Experience with process shifts, changes with design rules and product layout with individual process steps and their impact on Function Yield, Electrical Test and Product Performance as well as short- and long-term reliability implications.
Good communication and interpersonal skills.
Able to work on cross-functional and geographically dispersed teams with diverse backgrounds.
A team player that can multitask and thrive in a very dynamic and fast-paced environment.
Interpersonal Skills:
Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
Able to take initiatives, adapt priorities and responsibilities to support business needs.
Hands-on participant with a strong sense of ownership.
A team player with leadership skills that can multitask and thrive in a very dynamic and fast-paced environment.
Goal driven with demonstrated ability of working in a high performing team culture.
Quick assimilation to new technology.
Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.
Shift expectations:
Standard work hours are Monday through Friday, with rotational shifts including swing shifts from 3:30 PM to 12:00 AM and occasional weekend shifts.
Candidates must be willing and able to work on-site at our Phoenix Arizona facility.
Work Location: Phoenix, AZ
Travel: May require travel dependent on business needs
Relocation assistance available
#LI-Onsite
TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences.
Related keywords
SemiconductorProcess IntegrationN4N3N2FabManufacturingNPIYieldReliabilityFEOLMEOLBEOLLithographyEtchThin Films
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
Offices: 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu, Taiwan 300, TW · 2851 Junction Ave, San Jose, California 95134, US · World Trade Center, Zuidplein 60, Amsterdam, Amsterdam 1077, NL · 16, Zifeng Road, Pukou Economic Development Zone, Nanjing, Jiangsu Province na, CN · 4000, Wen Xiang Road, Songjiang, Shanghai, Jiangsu Province 201616, CN
How many Manufacturing jobs are open in Phoenix, AZ right now?
There are currently 2,437 open manufacturing positions in Phoenix, AZ listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Manufacturing roles in Phoenix, AZ?
Companies currently hiring include Honeywell Technologies, ASM International N.V., Shamrock Foods Company, Marketech International Corporation USA, TSMC, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Manufacturing jobs in Phoenix, AZ?
Yes — 278 of the 2437 open manufacturing positions offer remote or hybrid work (44 remote, 234 hybrid).
How do I apply for Manufacturing jobs in Phoenix, AZ?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.