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$115k–$220k/yr
Full-time
bachelor degree, postgraduate degree
Competitive pay, Stock bonuses, Health insurance, Retirement programs, Vacation
Posted 2d ago
~40 hrs/week
Responsibilities
The engineer will drive the development of next-generation patterning processes and provide technical leadership for cross-functional problem solving to resolve complex process and defect issues. They are responsible for designing characterization plans, conducting experiments, and establishing control systems to optimize production performance and yield.
Requirements
Candidates must hold a PhD, Master's, or Bachelor's degree in a STEM field with relevant industry experience ranging from 0 to 4+ years depending on the degree level. Essential qualifications include hands-on experience in dry etch semiconductor manufacturing, plasma etch fundamentals, and expertise in statistical analysis methodologies.
Full job description
Job Details:
Job Description:
Business Group
At Intel, Design Technology Platform (DTP) is one of the key pillars enabling Intel to deliver winning products in the marketplace. You will directly drive and work with DTP cross functional teams to ensure design-kit leadership for customer enablement of cutting-edge technologies. You will work with customers to outline critical requirements, collaborate with Intel internal partners to define issue scope, plan execution, and innovate competitive solutions to meet customer needs.
About the Role
Join Intel Logic Technology Development and help advance the next generation of patterning.
You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities.
Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications.
Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap.
Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.
Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partner with key equipment and material suppliers to develop and implement enabling elements of the technology. Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Core Competencies
Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.
Ability to communicate technical data and concepts to both technical and non-technical audiences.
Qualifications:
The Minimum qualifications listed below are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience, academic projects, and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with relevant industry or graduate school research experience. -Or-
Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 2 years of relevant industry or graduate school research experience. -Or-
Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience at a leading foundry or dry etch equipment supplier.
Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
Experience with plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.
Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.
Preferred Qualifications:
4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies or dry etch equipment suppliers.
Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
Experience in managing complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
Expertise in APC development and variability reduction in a manufacturing environment.
Expertise in etch driven defect reduction and metrology in a manufacturing environment.
Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.
Join Intel's dynamic team and contribute to groundbreaking advancements in technology and help us shape the future today.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
• Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
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Offices: Robert Noyce Building, Santa Clara, California 95052, US · 1 NE Jones Farm Pkwy, Hillsboro, Oregon 97124, US · 4500 S Dobson Road, OC2-257, Chandler, Arizona 85226, US · Derekh Em HaMoshavot 94, Petah Tikva, Merkaz 49000, IL · 1900 Prairie City Rd, Folsom, CA 95630, US
Based on 209 listings with disclosed salaries, most technology jobs in Hillsboro, OR pay between $60k–$216k per year. Individual offers vary with seniority, company size, and specialization.
How many Technology jobs are open in Hillsboro, OR right now?
There are currently 302 open technology positions in Hillsboro, OR listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Technology roles in Hillsboro, OR?
Companies currently hiring include Intel, Applied Materials, Lam Research, Qorvo, Inc., SSOE Group, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Technology jobs in Hillsboro, OR?
Yes — 94 of the 302 open technology positions offer remote or hybrid work (4 remote, 90 hybrid).
How do I apply for Technology jobs in Hillsboro, OR?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.