Chandler, Arizona, United States · Hybrid
$122k–$232k/yr
Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the h…
Skills: Semiconductor packaging, Heterogeneous integration, Process integration, Modeling, Simulation
Hillsboro, Oregon, United States · On-site
The Opportunity: In this role, you will report to the supervisor of site services and will work closely with the Avantor’s Lab and Production Services professionals to serve our customers by performing customized, missio…
Skills: Inventory management, Cleanroom protocols, Material handling, Customer service, Microsoft Office
Hillsboro, Oregon, United States · On-site
$121k–$121k/yr
Job Details: Job Description: As a Module Engineering Intern within Intel's F25 Metals organization, you will work alongside engineers, technicians, and operations teams to support High Volume Manufacturing (HVM) of Inte…
Skills: Semiconductor manufacturing, Process improvement, Data analytics, Python, JMP
Hillsboro, Oregon, United States · On-site
$142k–$269k/yr
Job Details: Job Description: About the Role Intel's Quantum Computing Group is seeking a talented and motivated Quantum Cryoprober Engineer to join our team. In this role, you will be responsible for characterizing quan…
Skills: Quantum computing, Cryoprobing, Electrical measurements, Semiconductor characterization, Quantum dots
Hillsboro, Oregon, United States · On-site
$150k–$150k/yr
Job Details: Job Description: The Role and Impact As a Software Solutions Engineering PhD Intern, you will contribute to the development of integrated software solutions tailored to customer and platform needs. Your work…
Skills: Python, SQL, Software engineering, System-level understanding, Application development
Hillsboro, Oregon, United States · On-site
Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure ana…
Skills: Material analysis, Failure analysis, Sample preparation, SEM, EDX
Hillsboro, Oregon, United States · On-site
$63k–$89k/yr
Job Details: Job Description: In this position, you will work in an exciting electron microscopy lab supporting Intel's advanced technology development. Responsible for making ultra-thin specimens and/or performing TEM a…
Skills: Electron microscopy, TEM analysis, Dual beam FIB, Sample preparation, Failure analysis
Hillsboro, Oregon, United States · On-site
Work Schedule First Shift (Days) Environmental Conditions Cleanroom: no hair products, jewelry, makeup, nail polish, perfume, exposed piercings, facial hair etc... allowed, Office Job Description As part of the Thermo Fi…
Skills: Electrical Troubleshooting, New Product Introduction, Failure Analysis, Root Cause Analysis, Technical Documentation
Hillsboro, Oregon, United States · On-site
$142k–$200k/yr
Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the h…
Skills: Semiconductor processing, Device physics, CMOS, Thin films, FinFETs
Hillsboro, Oregon, United States · On-site
Work Schedule Standard (Mon-Fri) Environmental Conditions Office Job Description Why Join Us? At Thermo Fisher Scientific, our co-op program is designed to be a strategic pipeline for future leadership talent. Students w…
Skills: Metrology, Artificial intelligence, Machine learning, Computer vision, Image processing
Hillsboro, Oregon, United States · Hybrid
$134k–$189k/yr
Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to…
Skills: Lithography, Process development, Experimental design, Data analysis, Semiconductor manufacturing
Hillsboro, Oregon, United States · On-site
$60k–$85k/yr
Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure ana…
Skills: Material analysis, Failure analysis, Sample preparation, SEM, EDX
Hillsboro, Oregon, United States · On-site
$40/hr–$59/hr
POSITION SUMMARY Relocation Assistance available up to $15,000 Pay Range: $40.79/hr. to $59.17/hr. Please note, the shifts for this role will be mostly be Days, but there will be some coverage needed for Evenings. Positi…
Skills: Medical laboratory science, Quality control, Laboratory testing, Critical thinking, Instrumentation troubleshooting
Hillsboro, Oregon, United States · Remote OK
COMPANY DESCRIPTION: A career here is life-enhancing. At Syner-G, we enable our people to build careers that impact positively on their quality of life. Through our expertise, insight, consulting and management skills, w…
Skills: Validation lifecycle documentation, GMP compliance, Computerized systems validation, Risk assessment, Technical mentorship
Hillsboro, Oregon, United States · On-site
The Opportunity: In this role, you will report to the supervisor of site services and will work closely with the Avantor’s Lab and Production Services professionals to serve our customers by performing customized, missio…
Skills: Inventory management, Cleanroom protocols, Material handling, Customer service, Microsoft Office
Hillsboro, Oregon, United States · On-site
$134k–$189k/yr
Job Details: Job Description: Key Responsibilities The following responsibilities outline the primary duties and expectations of this role. Drives technology development and enables both high volume manufacturing and fut…
Skills: Semiconductor processing, Wafer-level assembly, Cleanroom environments, Process development, Statistical process control
Phoenix, Arizona, United States · Hybrid
$191k–$269k/yr
Job Details: Job Description: As a Silicon Packaging Architect, you will play a pivotal role in designing and driving end-to-end package solutions that meet physical, electrical, and cost requirements while ensuring high…
Skills: Semiconductor packaging, Package architecture, Design for manufacturing, Design of experiments, Technical documentation
Hillsboro, Oregon, United States · Hybrid
Employment Type: Full-Time Work Setting: Hybrid Work Location: Hillsboro, Oregon, United States Work Hours: Office hours Find out more here: https://semianalysis.com Position Overview SemiAnalysis is the leading independ…
Skills: Silicon reverse engineering, Semiconductor process integration, Advanced packaging, IC layout, Physical design
Hillsboro, Oregon, United States · On-site
$31/hr–$33/hr
Work Schedule First Shift (Days) Environmental Conditions Able to lift 40 lbs. without assistance, Adherence to all Good Manufacturing Practices (GMP) Safety Standards, Some degree of PPE (Personal Protective Equipment) …
Skills: Product testing, Assembly, Integration, Troubleshooting, Machine set-up
Hillsboro, Oregon, United States · On-site
$21/hr–$24/hr
Overview Element is seeking a motivated and detail-oriented Computed Radiography (CR) Trainee to join our Hillsboro, OR lab team. This position provides a unique opportunity to build a career in Non-Destructive Testing (…
Skills: Computed Radiography, Non-Destructive Testing, X-ray Equipment Operation, Aerospace Inspection, Digital Radiographic Imaging
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The Semiconductor Packaging Research Engineer drives technology research for advanced packaging and heterogeneous integration, focusing on evaluating new architectures and materials. They are responsible for defining integration flows, developing multi-physics models, and collaborating across cross-functional teams to ensure technology readiness.
Candidates must hold a Master’s or Ph.D. in a relevant engineering or science field with at least one year of experience in semiconductor packaging research or process integration. Proficiency in modeling tools and a strong understanding of advanced packaging technologies like chiplets or 2.5D/3DIC are required.
Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below.
Position Summary: The Semiconductor Packaging Research Engineer drives technology research for advanced packaging and heterogeneous integration. The role is suited for candidates with expertise in either packaging process integration or modeling/simulation, with a focus on evaluating new architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.
Key Responsibilities
Research advanced packaging concepts such as chiplets, heterogeneous integration, 2.5D/3DIC, hybrid bonding, interposer, and die-to-die interconnects.
Drive either process integration learning or modeling/simulation to assess feasibility, reliability, manufacturability, and technology readiness.
For process integration: define integration flows, research vehicles, DOE, defect/yield learning, qualification evidence, and risk mitigation paths.
For modeling: develop and validate thermal, thermo-mechanical, electrical, reliability, or multi-physics models using experimental and failure analysis data.
Translate product needs into research hypotheses, technical plans, and recommendations; document outputs through reports, design guidance, IP, publications, and development-transfer inputs.
Collaborate across research, design, process, materials, reliability, manufacturing, supplier, university, and ecosystem teams.
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Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Required Qualifications
Master’s or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, Computational Mechanics, Microelectronics, Semiconductor Manufacturing, or related field.
1+ years’ experience in semiconductor packaging research, advanced packaging integration, process integration, modeling/simulation, reliability, materials, or heterogeneous integration.
1+ years' experience in one or more of the following areas: process integration, research vehicle execution, DOE, defect/yield learning, reliability, model development& validation, or multi-physics simulation.
1+ years' experience with advanced packaging technologies such as flip chip, chiplets, 2.5D/3DIC, fan-out, hybrid bonding, interposers, HBM integration, advanced substrates, or die-to-die interconnects.
Preferred Qualifications
Ph.D. or deep technical specialization in packaging process integration, computational mechanics, thermal sciences, electrical modeling, materials reliability, or microelectronics research and 4+ years of relevant experience.
Experience with prototype builds, technology readiness assessment, research-to-development transfer, package-system co-optimization, or chip-package-board co-design.
Modeling tool experience such as ANSYS, Abaqus, COMSOL, HFSS, Cadence, MATLAB, Python, JMP, or equivalent platforms.
Record of patents, publications, conference presentations, technical reports, methodology development, or competitive technology assessments.
Ability to turn ambiguous research problems into clear assumptions, experiments, learning milestones, qualification metrics, and actionable recommendations.
Key Competencies
Advanced packaging research and pathfinding
Process integration or modeling/simulation expertise
Heterogeneous integration, chiplet, and advanced substrate knowledge
DOE, prototype learning, reliability assessment, or model validation
Technology readiness evaluation and cross-functional communication
Success Measures
Research outputs identify credible integration options, technology limiters, and trade-offs for future platforms.
Process integration or modeling results are supported by clear assumptions, evidence, validation data, and documented limitations.
Prototype, DOE, or simulation learning improves feasibility, reliability, integration robustness, and manufacturability understanding.
Key risks are identified early with practical mitigation paths and development-transfer recommendations.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits | Intel Careers for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop .
Offices: Robert Noyce Building, Santa Clara, California 95052, US · 1 NE Jones Farm Pkwy, Hillsboro, Oregon 97124, US · 4500 S Dobson Road, OC2-257, Chandler, Arizona 85226, US · Derekh Em HaMoshavot 94, Petah Tikva, Merkaz 49000, IL · 1900 Prairie City Rd, Folsom, CA 95630, US
Based on 115 listings with disclosed salaries, most science & research jobs in Hillsboro, OR pay between $66k–$220k per year. Individual offers vary with seniority, company size, and specialization.
There are currently 173 open science & research positions in Hillsboro, OR listed on Clera. New openings are added daily as companies post roles.
Companies currently hiring include Intel, Thermo Fisher Scientific, Applied Materials, Oregon Health and Science University Hospital, Hillsboro Medical Center, among others. Browse the listings above to see every active employer.
Yes — 39 of the 173 open science & research positions offer remote or hybrid work (3 remote, 36 hybrid).
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.
