Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: Advanced packaging, 3D-stacked photonics, Signal integrity, Power integrity, Thermal-mechanical analysis
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: 3D Packaging, Photonics Packaging, Assembly Process Development, Test Chip Design, Fiber Attach
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: Foundry Process Technology, Silicon Manufacturing, Photonics, Design-For-Manufacturing, Yield Monitoring
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: Finite Element Analysis, Thermo-mechanical Simulation, Ansys, Abaqus, Python
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: Silicon Photonics Test Development, High-Speed Photonic Device Test, Python, System Link Bring-up, Characterization
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: Power Integrity, Signal Integrity, Power Delivery Networks, SoC Design, PCB Design
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: Signal Integrity, Power Integrity, Packaging, High-speed Interfaces, PCIe
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Skills: IC Package Layout, Allegro X APD, Signal Integrity, Power Integrity, Substrate Design
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting…
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Mountain View, California, United States · On-site
Entry levelVisa sponsorship$595M raised
Kodiak Robotics, Inc. was founded in 2018 and has become a leader in autonomous ground transportation committed to a safer and more efficient future for all. The company has developed an artificial intelligence (AI) powe…
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Mountain View, California, United States · On-site
Entry levelVisa sponsorship$595M raised
Kodiak Robotics, Inc. was founded in 2018 and has become a leader in autonomous ground transportation committed to a safer and more efficient future for all. The company has developed an artificial intelligence (AI) powe…
Skills: C++, Kinematics, Linear algebra, Calculus, Graph search
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$218k–$317k/yr
Full-time
postgraduate degree
Comprehensive Health Care Plan, Retirement Savings Matching Program, Life Insurance, Generous Time Off, Paid Family Leave, Short Term & Long Term Disability
Posted 17d ago
~40 hrs/week
Responsibilities
The Packaging Architect will own the development of advanced packaging solutions from concept through product release, collaborating with cross-functional teams to define technical specifications. They will drive architecture trade-offs and partner with supply chain and quality teams to ensure performance, cost, and manufacturability objectives are met.
Requirements
Candidates must hold a Ph.D. or Master's degree in a relevant engineering field and possess over 15 years of experience in advanced packaging technologies. Deep expertise in signal/power integrity, thermal analysis, or optical packaging is required, along with a proven track record of delivering products from concept to production.
Full job description
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!
If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Lightmatter is (re)inventing the future of computing with light!
About This Role
As a Packaging Architect, you will own the development of advanced packaging solutions from concept through product release, partnering with cross-functional teams across substrate design, signal integrity, and power integrity. Working directly with product architects, chip designers, and system architects, you will translate complex technical requirements into precise packaging specifications that balance performance, cost, and manufacturability.
You will serve as a key technical decision-maker, driving architecture trade-offs, aligning stakeholders, and ensuring packaging solutions meet both engineering and business objectives across the full product lifecycle.
Responsibilities
Evaluate and execute trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies, analyzing impact on performance, power efficiency, cost, manufacturability, and form factor.
Define and own packaging specifications spanning electrical, thermal, and mechanical performance, ensuring alignment with project budget and schedule.
Determine optimal package architecture through rigorous analysis of competing design constraints across the silicon, package, and system levels.
Partner with supply chain engineering to define technology and material requirements for substrate fabrication, assembly, and raw material vendors.
Collaborate with Quality & Reliability (Q&R) teams on packaging requirements, qualification criteria, and issue resolution.
Engage with product teams and customers in the data center and high-performance compute segments to anticipate emerging packaging architectures and influence roadmap direction.
Monitor the competitive landscape in packaging technologies to inform strategic and technical decisions.
Required Qualifications
Ph.D. or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
15+ years of experience in advanced (2D/3D) packaging technologies, with exposure to optical packaging.
10+ years of deep expertise in one or more of the following domains: power/signal integrity, thermal-mechanical analysis, or optical packaging.
Demonstrated ability to perform system-level trade-offs across silicon, package, and board to define packaging technology solutions for complex products.
Extensive experience with high-speed interfaces including SERDES, PCIe, and die-to-die (D2D) interconnects, and their implications for substrate selection, interconnect architecture, signal integrity, and thermal management.
Proven track record of delivering successful packages and products from concept through production release.
Proficiency with industry-standard EDA and CAD tools.
Preferred Qualifications
Strong communication and collaboration skills, with experience working across engineering, supply chain, and external supplier organizations.
Technical leadership experience managing complex, multi-disciplinary projects under demanding technical and schedule constraints.
Ability to operate independently, drive decisions with minimal supervision, and manage ambiguity effectively.
Creative problem-solver with a track record of finding practical solutions under pressure.
We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data.
Salary Range: total compensation goes beyond base salary, it also includes a new hire equity grant, annual performance-based equity, and other rewards that recognize your impact and contribution.
$218,000—$317,000 USD
Benefits
Comprehensive Health Care Plan (Medical, Dental & Vision)
Retirement Savings Matching Program
Life Insurance (Basic, Voluntary & AD&D)
Generous Time Off (Vacation, Sick & Public Holidays)
Paid Family Leave
Short Term & Long Term Disability
Training & Development
Commuter Benefits
Flexible, hybrid workplace model
Equity grants (applicable to full-time employees)
Benefits eligibility may vary depending on your employment status and location. Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.
Export Control
Candidates should have capacity to comply with the federally mandated requirements of U.S. export control laws.
Related keywords
Packaging ArchitectAI data centerPhotonics3D-stackedPassageHPCEIC/PICDie-to-dieFiber attachmentSubstrate fabricationThermal managementEDACADSERDESPCIeInterconnects
We are building the engine that will power discoveries, drive progress, and redefine what computers—and human beings—are capable of.
Offices: 800 W El Camino Real, Mountain View, California 94040, US · 100 Summer St, Boston, Massachusetts 02136, US · 18 King St E, Suite 1200, Toronto, Ontario M5C 1C4, CA
How much do Science & Research jobs in Mountain View, CA pay?
Based on 319 listings with disclosed salaries, most science & research jobs in Mountain View, CA pay between $146k–$292k per year. Individual offers vary with seniority, company size, and specialization.
How many Science & Research jobs are open in Mountain View, CA right now?
There are currently 355 open science & research positions in Mountain View, CA listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Science & Research roles in Mountain View, CA?
Companies currently hiring include Google, Lightmatter, DensityAI, Samsung Research America (SRA), Kodiak, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Science & Research jobs in Mountain View, CA?
Yes — 74 of the 355 open science & research positions offer remote or hybrid work (4 remote, 70 hybrid).
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