Hsinchu, Taiwan · On-site
Sr. Staff Engineer, Hardware Module Integration Location: Hsinchu (onsite) Ayar Labs is shattering AI data bottlenecks by moving data at the speed of light. As pioneers of co-packaged optics (CPO), we are using light ins…
Skills: Analog Circuit Design, Digital Circuit Design, PCB Layout, Embedded Systems, Firmware Development
ASM International N.V.Hsinchu, Taiwan · On-site
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more…
Skills: CMP Module Process Development, Project Management, Analytical Skills, Leadership, Cross-functional Collaboration
Qnity, Inc.Hsinchu, Taiwan · On-site
Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your p…
Skills: Technical Data Collection, Material Manufacture Process, FPCB Manufacturing, PCB Manufacturing, Electrical Testing
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: ## General Summary Qualcomm is transforming the automotive industry with the Snapdragon Digital…
Skills: System Level Test, Hardware Debugging, Python, C/C++, JTAG
Hsinchu, Taiwan · On-site
【Main Task】 • Shift works required. • Work and perform in compliance with company’s regulation and request. • Perform Technical Field Service activities －Installation and commissioning of equipment －Troubleshooting, repa…
Skills: Installation and Commissioning, Troubleshooting, Equipment Maintenance, Coordinate Measuring Machines, Matlab
Hsinchu, Taiwan · On-site
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, …
Skills: Image Processing, Signal Processing, Artificial Intelligence, Machine Learning, Deep Learning
Hsinchu, Taiwan · On-site
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. We are looking for an R&D Software Engineer to join our world-class engineering team. This position is respons…
Skills: C++, C, Unix/Linux, Data Structures, Algorithms
Hsinchu, Taiwan · On-site
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, …
Skills: Analytical Chemistry, Electrochemical Analysis, Spectroscopy, Chromatography, HPLC
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: ## General Summary Qualcomm is transforming the automotive industry with the Snapdragon Digital…
Skills: System Level Test, Hardware Debugging, Python, C/C++, JTAG
Hsinchu, Taiwan · On-site
We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude. Job Description 1. RF Module Design and Development: - Design and implement RF circui…
Skills: RF Module Design, ADS, HFSS, CST, Network Analyzers
Hsinchu, Taiwan · On-site
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Skills: Foundry Engineering, FEOL, MEOL, BEOL, AI/ML Integration
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Role and Responsibilities Own and drive advanced package selection, new generation product pac…
Skills: Cadence APD, Cadence SiP, Package Layout, Physical Design, SI/PI Analysis
Hsinchu, Taiwan · On-site
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology …
Skills: Physical Design, Verification, Full-chip Integration, RTL to GDS Flow, Python
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Role and Responsibilities Own and drive advanced package selection, new generation product pac…
Skills: Cadence APD, Cadence SiP, Package Layout, SI/PI Analysis, Flip Chip BGA
Hsinchu, Taiwan · On-site
HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across A…
Skills: OSAT Management, Semiconductor Testing, Production Scheduling, Yield Optimization, Vendor Management
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Board Level System Design, IC Top Level Floorplanning, System Level Co-design, SI Constraints, RF Constraints
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued s…
Skills: Thermal Modeling, CFD, ANSYS-Icepak, FloTHERM, Thermal Testing
Hsinchu, Taiwan · On-site
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network
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Design and develop analog and digital circuits for embedded electronic systems, focusing on high-performance laser driver architectures. Collaborate with cross-functional teams to handle hardware bring-up, debugging, and product integration from concept to production.
Requires a Bachelor's degree in Electrical or Computer Engineering with over 5 years of industry experience in embedded systems and electronics design. Proficiency in hardware debugging, communication protocols, and scripting languages like Python or MATLAB is essential.
Moving data at the speed of AI
Ayar Labs is transforming AI infrastructure by accelerating data movement. Recognizing that the complexity and size of AI models are increasing at a rate that traditional interconnect technology cannot handle, the company has developed the industry’s first optical I/O solution that enables customers to maximize the compute efficiency and performance of growing AI infrastructure, while reducing costs, latency and power consumption. Based on open standards and optimized for both AI training and inference, Ayar Labs’ optical I/O solution is backed by a robust ecosystem that enables it to integrate smoothly into AI systems at scale.
Offices: 695 River Oaks Pkwy, San Jose, California 95134, US · 5909 Christie Ave, Emeryville, California 94608, US · 678 Massachusetts Ave, Suite 401, Cambridge, Massachusetts 02139, US
There are currently 272 open science & research positions in Hsinchu, Taiwan listed on Clera. New openings are added daily as companies post roles.
Companies currently hiring include Qualcomm, KLA, Qnity, Inc., Lam Research, Applied Materials, among others. Browse the listings above to see every active employer.
Yes — 25 of the 272 open science & research positions offer remote or hybrid work (5 remote, 20 hybrid).
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.
