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$191k–$269k/yr
Full-time
bachelor degree, postgraduate degree
Competitive pay, Stock bonuses, Health insurance, Retirement programs, Vacation
Posted 8d ago
~40 hrs/week
Responsibilities
You will design and drive end-to-end semiconductor package solutions while overseeing the development process from design through production readiness. This involves collaborating across silicon, hardware, and manufacturing teams to ensure performance, reliability, and cost-effectiveness.
Requirements
Candidates must hold a degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field with at least 4 to 9 years of relevant experience. Proficiency in semiconductor package architecture, Design for Manufacturing (DFM), and Design of Experiments (DOE) is required.
Full job description
Job Details:
Job Description:
As a Silicon Packaging Architect, you will play a pivotal role in designing and driving end-to-end package solutions that meet physical, electrical, and cost requirements while ensuring high-quality output. You will oversee the complete packaging development process, from design through production readiness, resolving technical challenges and delivering innovative, cost-effective solutions. Your expertise in package architecture will contribute directly to Intel's success by enabling seamless integration of silicon and hardware technologies.
Business group
You will be part of a dynamic organization focused on delivering cutting-edge packaging solutions that align with Intel's broader innovation goals. This team works collaboratively across silicon, hardware, and manufacturing domains to ensure that Intel's products meet stringent performance, reliability, and quality standards. Together, the group contributes to Intel's leadership in advanced semiconductor packaging technologies, enabling the creation of world-class products.
Key Responsibilities
Translate product requirements into detailed package architecture specifications.
Lead technology trade-off decisions ensuring packaging solutions meet electrical, mechanical, thermal, and reliability standards.
Collaborate with silicon, hardware, and package leads to deliver high-quality package outputs and address roadblocks.
Oversee the packaging development process, including design, processes, and procedures, while driving continuous improvement in packaging quality standards.
Apply expertise in troubleshooting package designs, resolving technical issues, and delivering innovative, cost-effective solutions.
Partner with manufacturing teams to ensure seamless design-to-production transitions and support tape-out readiness.
Utilize Design for Manufacturing (DFM) principles to optimize package designs for manufacturability and production efficiency.
Maintain and refine technical documentation to support package development processes.
Behavioral traits
Excellent analytical, communication, and problem-solving skills to influence and drive results effectively.
Collaborate cross-functionally with diverse teams in silicon, hardware, and manufacturing domains.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
Bachelor's degree Mechanical Engineering, Electrical Engineering, Materials Science or related field with 9+ years of hands-on experience OR a Master's degree in a relevant field with 6+ years of hands-on experience OR a PhD in a relevant field with 4+ years of hands-on experience
4+ years of experience in:
Defining semiconductor/electronic package architectures and developing technical documentation.
Experience applying Design for Manufacturing (DFM) principles
Utilizing Design of Experiments (DOE) methodologies
Troubleshooting package design and manufacturing issues
Preferred Qualifications
Advanced understanding of semiconductor packaging technologies and industry trends.
Experience leading cross-disciplinary teams in a technical environment.
We invite you to join us in shaping the future of technology by applying your expertise in cutting-edge packaging solutions. Be part of a dynamic team that thrives on innovation and collaboration, and contribute to creating a lasting impact in the world of semiconductor technology.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
• Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
.
Offices: Robert Noyce Building, Santa Clara, California 95052, US · 1 NE Jones Farm Pkwy, Hillsboro, Oregon 97124, US · 4500 S Dobson Road, OC2-257, Chandler, Arizona 85226, US · Derekh Em HaMoshavot 94, Petah Tikva, Merkaz 49000, IL · 1900 Prairie City Rd, Folsom, CA 95630, US
How much do Engineering jobs in Hillsboro, OR pay?
Based on 242 listings with disclosed salaries, most engineering jobs in Hillsboro, OR pay between $42k–$203k per year. Individual offers vary with seniority, company size, and specialization.
How many Engineering jobs are open in Hillsboro, OR right now?
There are currently 397 open engineering positions in Hillsboro, OR listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Engineering roles in Hillsboro, OR?
Companies currently hiring include Intel, Applied Materials, Entegris, QUANTUM GLOBAL TECHNOLOGIES, LLC, Lam Research, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Engineering jobs in Hillsboro, OR?
Yes — 91 of the 397 open engineering positions offer remote or hybrid work (4 remote, 87 hybrid).
How do I apply for Engineering jobs in Hillsboro, OR?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.