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Full-time
bachelor degree, postgraduate degree
Posted 16d ago
~40 hrs/week
Responsibilities
Lead mechanical design and thermal analysis for next-generation microelectronic packaging in defense and aerospace applications. Collaborate with cross-functional teams to optimize packaging at the die, package, and board levels using simulation tools.
Requirements
Requires a BSME/MSME degree and at least 12 years of experience in semiconductor packaging. Must be an expert in ANSYS and Solidworks with deep knowledge of microelectronic assembly processes and US Person status.
Full job description
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
Qorvo is looking for an experienced Prinicipal Mechanica/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and analysis efforts of electronics packaging for defense communications, radar and electronic warfare applications.
RESPONSIBILITIES
Principal level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on structural analysis
Chosen candidate will work closely with select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
Using FEA and other industry standard simulations tools:
Perform detailed modeling and optimization of packaging design at the die/package/board level
Develop and execute thermal and mechanical stress measurement techniques to support analysis for internal and external customers
Guide package and substrate design decisions that meet performance specifications and yield requirements
Supervise and respond to manufacturing issues as they occur
Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends
Support external customers with applications models and failure analysis support
QUALIFICATIONS:
BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 12 years’ experience in semiconductor packaging
Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
Expert level skill with ANSYS and Solidworks, or similar
Expert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow
Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment
Knowledge of reliability calculation methods for semiconductors
Understanding of GD&T, ANSI standards and tolerance stack-ups required
Demonstrated ability to work with cross-functional teams
Excellent verbal communication and interpersonal skills
Excellent written communications skills
This position is not eligible for visa sponsorship by the Company.
This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).
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MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, infrastructure and mobile. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.
Offices: Greensboro, US
RF Front EndsPremium FiltersPower AmplifiersSwitch ProductsFoundryAntenna Control SolutionsGallium Nitride (GaN)Systems on a Chip (SOCs)Power Management ICsAntenna Switch Modules
How many Manufacturing jobs are open in Richardson, TX right now?
There are currently 603 open manufacturing positions in Richardson, TX listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Manufacturing roles in Richardson, TX?
Companies currently hiring include Celestica, Qorvo, Inc., Texas Instruments, Lennox, GlobalFoundries, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Manufacturing jobs in Richardson, TX?
Yes — 36 of the 603 open manufacturing positions offer remote or hybrid work (9 remote, 27 hybrid).
How do I apply for Manufacturing jobs in Richardson, TX?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.