Engineering Jobs in Shenzhen, China (Now Hiring) — 418 open — Page 3

Location: Shenzhen, China

Job Summary:

The Shenzhen Applications Engineering (AE) Team serves as a critical technical interface between customers, field application engineers (FAEs), and Semtech's global engineering organizations. Our mission is to accelerate customer success by providing expert technical support and advanced validation capabilities for high-speed optical communication products.

Responsibilities:

• Design hardware to support operation of complex Integrated Transceiver products using a variety of tools to facilitate high speed data transmission at data rates more than 10Gbps.
• Use a variety of tools to capture Schematic intent, design high speed PCB’s with the ability to consider and simulate the associated signal integrity issues.
• Work with BU AEs to perform the test/develop task.
• Provide Direct Customer Support and associate technical solutions, in close association with the Sales team. Contributing towards achieving “design-in” status for our products.
• Perform fault finding, debugging and resolution of internal and customer issues.
• Produce, contribute and help maintain project documentation such as Application Notes and Application Kits. Show a commitment to quality in the full development cycle of Design, Development and Documentation.
• Proactively working with other groups including Product Marketing/Sales & Design Engineering to resolve customer concerns and during the product development cycle.
• Attend Design Reviews and cover Applications based questions that may occur.
• Develop detailed knowledge of the products that they are responsible for supporting, by reading the supporting literature and from lab-based testing.

Qualifications:

• Bachelor’s degree in electrical engineering, Optical Communication, or related field
• More than 5 years’ work experience in optical module products.
• Good knowledge of Analogue and Digital/MCU circuit design.
• Understanding and experience of high speed printed circuit board (PCB) design, coupled with the ability to use PCB design tools to deliver complete hardware solutions.
• Experience of Signal Integrity issues associated with high-speed data transfer and the ability to design solutions that overcome these issues.
• Experience of using measurement equipment to perform key parametric measurements using equipment such as Communication Analysers, Bit Error Rate Testers, Optical Laser Sources/Attenuators, High-Speed real-time scopes, etc.
• Knowledge SFF-8472/8636/CMIS Specification for Diagnostic Monitoring Interface for Optical Transceivers would be desirable but not a necessity.
• 400G/800G/1.6T DSP Optical module R&D experience is preferred.
• Be familiar with the protocol standards of the PON product system is preferred.
• Be familiar with Python scripts for automated testing.
• The candidate should have initiative, technical aptitude and creativity, is results oriented and can flexibly manage time, priorities and multiple projects
• Have good command of the English language in speaking, reading and writing
• Excellent organizational, networking, interpersonal and communication skills
• Have the ability to work well within team environment as well as an independent contributor