Engineering Jobs in Hsinchu, Taiwan (Now Hiring) — 636 open — Page 22

CS - UIR General Project Leader - Hsinchu

Hsinchu, Taiwan · On-site

Senior$526M raised

Key Responsibilities * Lead and coordinate UIR-related projects and initiatives from planning through execution, ensuring delivery of agreed objectives, milestones, quality, and business outcomes. * Drive project executi…

Skills: Project Management, Stakeholder Management, Cross-functional Collaboration, Risk Mitigation, Analytical Thinking

Head of Materials AI

Hsinchu, Taiwan · On-site

Senior+

Your Role As we are in the middle of a fundamental shift in how R&D gets done. Over the next several years, AI, automation, and connected data infrastructure will reshape every stage of the materials discovery cycle, fro…

Skills: AI Strategy, Machine Learning, Bayesian Optimization, Large Language Models, Digital Transformation

Package/System Design Engineer (PMIC SIP and Module)

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…

Skills: Board Level System Design, IC Top Level Floorplanning, System Level Co-design, SI Constraints, RF Constraints

Thermal Engineer

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued s…

Skills: Thermal Modeling, CFD, ANSYS-Icepak, FloTHERM, Thermal Testing

DC Char ATE Test Engineer, up to Sr.

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm Technologies, Inc. (QTI) is a world leader in 3G, 4G, 5G and next-generation wireless …

Skills: ATE Testing, Advantest 93K, VLSI, Mixed-Signal Design, Python

Package/System Design Engineer (PMIC SIP and Module)

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…

Skills: Board Level System Design, IC Top Level Floorplanning, System Level Co-design, SI Constraints, RF Constraints

Package/System Design Solution Engineer, Up to Senior

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…

Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network

T3R010-NPI Technical Project Leader

Hsinchu, Taiwan · On-site

Senior

We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude. Job Description 1. Good communication skill between customer and internal. Fluent spe…

Skills: NPI, SIP Module Package Technology, Project Leadership, Technical Communication, System Integration

CS -CS - UIR Knowledge Management Project Lead - Hsinchu

Hsinchu, Taiwan · On-site

Senior$526M raised

Knowledge & Training Management Lead Knowledge Management initiatives for EUV UIR and DUV UIR domains.Plan, organize with GTC on training programs, including qualification and follow-up.Design and execute cross‑competenc…

Skills: Knowledge Management, Training Program Management, Skill Tracking, Stakeholder Management, Cross-Functional Collaboration

Thermal Engineer

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued s…

Skills: Thermal Modeling, CFD, ANSYS-Icepak, FloTHERM, Thermal Testing

Package/System Design Solution Engineer, Up to Senior

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…

Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network

Package/System Design Solution Engineer, Up to Senior

Hsinchu, Taiwan · On-site

Mid level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…

Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network

Technical Program Manager 4

Hsinchu, Taiwan · Hybrid

Senior+$10M raised

The group you’ll be a part of In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are…

Skills: Technical Program Management, Operational Readiness, Cross-functional Leadership, Risk Mitigation, Dependency Management

TW Sr Account Manager I

Hsinchu, Taiwan · Hybrid

Senior+$10M raised

The group you’ll be a part of The Global Customer Operations Group brings industry insights and experience to help our customers deliver on their technology roadmaps. We work tirelessly to earn the trust of our customers…

Skills: Account Management, Customer Relationship Management, Strategic Planning, Wafer Fabrication Equipment, Customer Operations

TW Sr Account Manager I

Hsinchu, Taiwan · On-site

Senior+$10M raised

The group you’ll be a part of The Global Customer Operations Group brings industry insights and experience to help our customers deliver on their technology roadmaps. We work tirelessly to earn the trust of our customers…

Skills: Account Management, Customer Relationship Management, Strategic Planning, Wafer Fabrication Equipment, Customer Operations

Regional Development Applications Engineer

Hsinchu, Taiwan · On-site

Mid level$758M raised

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, …

Skills: Wafer Inspection, Recipe Setup, Root Cause Analysis, Data Analysis, Technical Reporting

Lead Product Manager

Hsinchu, Taiwan · On-site

Senior$75M raised

Job Title: Lead Product Manager Job Description: The Role Entegris is seeking a highly motivated and results-driven Product Manager to lead advanced packaging product lines and strategic customer engagements in Asia, wit…

Skills: Product Management, New Product Development, Semiconductor Industry, Advanced Packaging, Customer Engagement

CR2121 Switch系統硬體測試工程師

Hsinchu, Taiwan · On-site

Mid level

We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude. Job Description 1.硬體測試與驗證: -設計與執行硬體測試計劃,進行功能性、效能及可靠性測試。 -使用測試儀器或tool(如iperf、 IxChario…

Skills: Hardware Testing, Hardware Verification, Fault Troubleshooting, Data Analysis, Technical Support

PTE HW Engineer, Sr. (Zhubei)

Hsinchu, Taiwan · On-site

Senior$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: The QCT Product & Test group has an opening for a test board design position. This group develo…

Skills: Probe Card Design, PCB Design, Signal Integrity, Power Integrity, Hardware Design

RFFE Product and Test Engineer (Zhubei)

Hsinchu, Taiwan · On-site

Entry level$4M raised

Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Overview Qualcomm is the world’s leading wireless technology innovator and the driving forc…

Skills: RF Troubleshooting, Analog RF Debugging, Digital Hardware, Oscilloscopes, Signal Generators

Frequently asked questions

How many Engineering jobs are open in Hsinchu, Taiwan right now?

There are currently 636 open engineering positions in Hsinchu, Taiwan listed on Clera. New openings are added daily as companies post roles.

Which companies are hiring for Engineering roles in Hsinchu, Taiwan?

Companies currently hiring include Qualcomm, WNC Corporation, Lam Research, Applied Materials, Qnity, Inc., among others. Browse the listings above to see every active employer.

Are there remote or hybrid Engineering jobs in Hsinchu, Taiwan?

Yes — 58 of the 636 open engineering positions offer remote or hybrid work (7 remote, 51 hybrid).

How do I apply for Engineering jobs in Hsinchu, Taiwan?

Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.