Key Responsibilities * Lead and coordinate UIR-related projects and initiatives from planning through execution, ensuring delivery of agreed objectives, milestones, quality, and business outcomes. * Drive project executi…
Your Role As we are in the middle of a fundamental shift in how R&D gets done. Over the next several years, AI, automation, and connected data infrastructure will reshape every stage of the materials discovery cycle, fro…
Skills: AI Strategy, Machine Learning, Bayesian Optimization, Large Language Models, Digital Transformation
Package/System Design Engineer (PMIC SIP and Module)
Hsinchu, Taiwan · On-site
Mid level$4M raised
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Board Level System Design, IC Top Level Floorplanning, System Level Co-design, SI Constraints, RF Constraints
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued s…
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm Technologies, Inc. (QTI) is a world leader in 3G, 4G, 5G and next-generation wireless …
Skills: ATE Testing, Advantest 93K, VLSI, Mixed-Signal Design, Python
Package/System Design Engineer (PMIC SIP and Module)
Hsinchu, Taiwan · On-site
Mid level$4M raised
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Board Level System Design, IC Top Level Floorplanning, System Level Co-design, SI Constraints, RF Constraints
Package/System Design Solution Engineer, Up to Senior
Hsinchu, Taiwan · On-site
Mid level$4M raised
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network
We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude. Job Description 1. Good communication skill between customer and internal. Fluent spe…
CS -CS - UIR Knowledge Management Project Lead - Hsinchu
Hsinchu, Taiwan · On-site
Senior$526M raised
Knowledge & Training Management Lead Knowledge Management initiatives for EUV UIR and DUV UIR domains.Plan, organize with GTC on training programs, including qualification and follow-up.Design and execute cross‑competenc…
Skills: Knowledge Management, Training Program Management, Skill Tracking, Stakeholder Management, Cross-Functional Collaboration
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued s…
Package/System Design Solution Engineer, Up to Senior
Hsinchu, Taiwan · On-site
Mid level$4M raised
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network
Package/System Design Solution Engineer, Up to Senior
Hsinchu, Taiwan · On-site
Mid level$4M raised
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Enginee…
Skills: Package Design, System Co-design, Electrical Modeling, Signal Integrity, Power Distribution Network
The group you’ll be a part of In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are…
The group you’ll be a part of The Global Customer Operations Group brings industry insights and experience to help our customers deliver on their technology roadmaps. We work tirelessly to earn the trust of our customers…
The group you’ll be a part of The Global Customer Operations Group brings industry insights and experience to help our customers deliver on their technology roadmaps. We work tirelessly to earn the trust of our customers…
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, …
Skills: Wafer Inspection, Recipe Setup, Root Cause Analysis, Data Analysis, Technical Reporting
Job Title: Lead Product Manager Job Description: The Role Entegris is seeking a highly motivated and results-driven Product Manager to lead advanced packaging product lines and strategic customer engagements in Asia, wit…
We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude. Job Description 1.硬體測試與驗證: -設計與執行硬體測試計劃,進行功能性、效能及可靠性測試。 -使用測試儀器或tool(如iperf、 IxChario…
Skills: Hardware Testing, Hardware Verification, Fault Troubleshooting, Data Analysis, Technical Support
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: The QCT Product & Test group has an opening for a test board design position. This group develo…
Skills: Probe Card Design, PCB Design, Signal Integrity, Power Integrity, Hardware Design
Company:Qualcomm Semiconductor Limited Job Area:Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Overview Qualcomm is the world’s leading wireless technology innovator and the driving forc…
Skills: RF Troubleshooting, Analog RF Debugging, Digital Hardware, Oscilloscopes, Signal Generators
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Full-time
Posted 40d ago
~40 hrs/week
Responsibilities
Lead and coordinate UIR-related projects from planning through execution to ensure the delivery of business outcomes and quality milestones. Act as the primary interface between stakeholders across engineering, manufacturing, and supply chain to drive alignment and resolve issues.
Requirements
Requires proven project management capabilities and strong stakeholder influence skills within a matrix organization. Experience in the semiconductor or high-tech manufacturing industry is preferred.
Full job description
Key Responsibilities
Lead and coordinate UIR-related projects and initiatives from planning through execution, ensuring delivery of agreed objectives, milestones, quality, and business outcomes. Drive project execution by establishing clear priorities, tracking progress, managing risks, and ensuring timely resolution of issues. Build strong partnerships across Engineering, Manufacturing, Supply Chain, Logistics, Customer Support, and other supporting functions to achieve shared goals. Act as the primary interface between stakeholders, facilitating alignment, managing expectations, and ensuring transparent communication throughout the project lifecycle. Demonstrate ownership by proactively identifying challenges, driving solutions, and removing barriers to project success. Support organizational growth and changing business needs by continuously adapting priorities, project strategies, and resource plans. Influence decision-making and drive alignment within a matrix organization, often without direct reporting authority. Promote operational excellence through continuous improvement initiatives, process optimization, and lessons-learned activities. Monitor project performance through data-driven analysis and reporting, ensuring effective decision-making and risk management. Foster a culture aligned with ASML values of Care, Collaboration, and Challenge by encouraging teamwork, accountability, open communication, and continuous learning. Execute additional assignments, strategic initiatives, and business-critical tasks as delegated by management.
Required Skills & Competencies
Strong stakeholder management skills with the ability to influence and align diverse stakeholders at different organizational levels. Proven project management capability, including planning, execution, risk mitigation, issue resolution, and performance tracking. Excellent communication and interpersonal skills with demonstrated success in cross-functional collaboration. Ability to lead and drive results in a matrix organization without direct authority. Strong analytical thinking and structured problem-solving capabilities. High degree of flexibility, agility, and resilience in responding to changing business priorities and organizational growth. Strong ownership mindset with a focus on accountability, execution, and delivering sustainable results. Ability to balance strategic objectives with operational execution. Self-motivated, proactive, and capable of managing multiple priorities simultaneously.
Preferred Qualifications
Experience in the semiconductor, high-tech manufacturing, or capital equipment industry. Demonstrated success leading complex cross-functional projects within a global organization. * Familiarity with ASML operational processes, project governance, and continuous improvement methodologies.
Inclusion and diversity
ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.
Who are we?
ASML is an innovation leader in the global semiconductor industry. We make machines that chipmakers use to mass produce microchips. Founded in 1984 in the Netherlands with just a handful of employees, we’ve now grown to over 40,000 employees, 143 nationalities and more than 60 locations around the world.
What do we do?
We provide chipmakers with hardware, software and services to mass produce patterns on silicon through lithography. Our lithography systems use ultraviolet light to create billions of tiny structures on silicon that together make up a microchip. We push our technology to new limits to enable our customers to create smaller, faster and more powerful chips.
Who are our people?
While you may think that only engineers and mathematicians work at ASML, you'll be surprised to find out that our people come from a wide variety of backgrounds. Across ASML, we have dedicated teams that manage customer support, communications and media, IT, software development and more. Every team in the company is essential for pushing our technology and the industry forward.
If you love to tackle challenges and innovate in a collaborative, supportive and inclusive environment with all the flexibility and freedom to unleash your full potential, ASML is the place to be.
Join us!
Offices: De Run 6501, Veldhoven, 5504DR, NL · Matheson Street 1, Times Square Tower Two, Suites 3704-6, Hong Kong, HK · 2650 W Geronimo Pl, Chandler, Arizona 85224, US · 77 Danbury Road, Wilton, CT 06897, US · 11F, No.1, Sec 3, Gongdao 5th Road, Taifei ONE, Hsinchu City, 30069, TW
semiconductortechnologyhardwaresoftwarelithography machineand innovationTest and MeasurementMachinery ManufacturingElectronicsSemiconductor
How many Engineering jobs are open in Hsinchu, Taiwan right now?
There are currently 636 open engineering positions in Hsinchu, Taiwan listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Engineering roles in Hsinchu, Taiwan?
Companies currently hiring include Qualcomm, WNC Corporation, Lam Research, Applied Materials, Qnity, Inc., among others. Browse the listings above to see every active employer.
Are there remote or hybrid Engineering jobs in Hsinchu, Taiwan?
Yes — 58 of the 636 open engineering positions offer remote or hybrid work (7 remote, 51 hybrid).
How do I apply for Engineering jobs in Hsinchu, Taiwan?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.