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Full-time
bachelor degree, postgraduate degree
Competitive market pay, Equity, Comprehensive medical package, US onboarding experience at HQ in Silicon Valley
Posted 16d ago
~40 hrs/week
Responsibilities
Own the electrical debug and failure analysis of AI systems at contract manufacturing partners in Taiwan. Drive diagnosability, yield improvements, and product reliability from NPI bring-up through high-volume ramp.
Requirements
Requires a degree in Electrical Engineering and 2-8 years of experience in manufacturing test or product engineering. Must have hands-on board-level debug skills and fluency in both English and Mandarin.
Full job description
About Etched
Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode workloads. Our first products are heavily focused on inference. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Taiwan is where our products get built. Our Manufacturing Test Engineering team sits closest to the line — you will be the engineer the factory calls when a board, a module, or a rack does not pass.
Job Summary
As a Product Test Engineer on the Manufacturing Test Engineering team in Taiwan, you will own the electrical debug and failure analysis side of our AI systems at our contract manufacturing partners, taking products from NPI bring-up through high-volume ramp. You will work hands-on at the factory alongside CM/ODM engineers, and partner with our hardware, ASIC, diagnostics, test, and reliability teams in Taiwan and San Jose to drive diagnosability, manufacturing predictability, yield and material improvements, and product reliability.
This role focuses on PCBA and L10/L11 server diagnosability and efficiency of repair, plus the sustaining improvements that keep our AI hardware at the highest standards of quality and reliability.
Builds, bring-ups, and yield escalations require a hands-on approach and flexibility to adapt to critical project timelines as we move products from NPI through high-volume ramp.
Key Responsibilities
Troubleshooting & repair: Diagnose and repair electronic assemblies (PCBA) down to the component level; isolate faults across module, L10, and L11 levels.
Factory ownership: Work directly on-site with Contract Manufacturers (CMs) and ODMs in Taiwan to close capability gaps, improve yield, and qualify new components.
Ad-hoc bring-up: Support new-product and new-station bring-up on short notice — proto builds, DOE runs, first-article testing, and test station/fixture debug, often under compressed schedules.
Test execution: Set up and operate test equipment (oscilloscopes, spectrum analyzers, network analyzers, DMMs) and factory test stations.
Fixture design & implementation: Support (and over time lead) PCBA test fixture design and its factory implementation.
DFM/DFT: Drive DFM and DFT across the product lifecycle, partnering with EE designers and validation engineers to improve test coverage, manufacturability, and diagnosability.
Documentation & reporting: Maintain detailed records of failure data and repair actions; own and update debug procedures and FA/RMA SOPs used by the line.
Cross-functional support: Collaborate with design, quality, and production teams — across Taiwan and San Jose time zones — to resolve recurring issues and lift product yield.
Component & supply partnership: Partner with Component Engineering, Supply Chain, and Hardware teams to influence component selection and mitigate manufacturing risk early in the design cycle.
FMEA: Review and influence Process FMEA and Design FMEA, providing diagnostics input.
Yield leadership: Take point on complex issue resolution and drive defect and yield improvement initiatives to closure.
You may be a good fit if you have
Bachelor's or Master's degree in Electrical Engineering or a related field.
2–8 years of experience in manufacturing test, product, or electrical engineering — ideally gained inside a factory or working shoulder-to-shoulder with CM/ODM partners.
Hands-on board-level debug experience: schematics, electronics circuits, and PCB layouts.
Working knowledge of system hardware architectures and PCB fabrication/assembly processes.
Experience with DFX/DFM, yield assessment, and failure analysis.
Experience across NPI and sustaining environments, from proto bring-up to ramp.
Flexibility to adjust your schedule to meet project milestones and support critical build windows and to travel domestically to CM/ODM sites on short notice.
Working English for daily collaboration with our San Jose teams; fluent Mandarin for day-to-day factory work.
A collaborative, low-ego mindset — you will be the interface between Etched engineering and the factory floor.
You would set yourself apart from the crowd if you have
Experience in test fixture design and factory implementation support (ICT, BFT, FRU, SLT).
Hands-on experience with PCB CAD/CAE tools (e.g., Allegro, Valor) and design-to-build flows.
Scripting for test automation and failure-data analysis (Python, Linux).
Experience with high-performance compute, server, or data center hardware, including liquid-cooled systems.
Benefits
Competitive market pay + equity
Comprehensive medical package
US onboarding experience at our HQ in Silicon Valley, with ongoing travel to San Jose
Direct ownership of test engineering for a first-of-its-kind AI product, from first proto board to volume ramp
How we're different
Etched believes in the Bitter Lesson. We are the first inference-focused frontier AI system. Our addressable market is the entirety of inference, unlike many of our competitors.
We are a fully in-person team in San Jose and Taipei, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both and work across disciplines as needed.
Related keywords
AI SystemsPCBAL10/L11 ServerContract ManufacturingODMNPIDFXICTBFTFRUSLTAllegroValorHigh-Performance ComputeLiquid-Cooled SystemsASIC