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Full-time
bachelor degree, postgraduate degree
Health Insurance, Professional Development Opportunities, Certification Support
Posted 64d ago
~40 hrs/week
Responsibilities
Own the full-chip and block-level physical implementation from RTL to GDSII for high-performance ASICs. Drive timing, power, and area closure while performing tapeout signoff activities in advanced TSMC nodes.
Requirements
Requires a Bachelor's or Master's degree in Electrical Engineering and 8+ years of physical design experience, specifically with 5nm nodes or below. Proficiency with industry-standard tools like ICC2 and Innovus, along with scripting skills, is essential.
Full job description
ABOUT LUMILENS
At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing faster, cooler, and massively more efficient.
We’re a well-funded startup backed by Mayfield and led by veterans who’ve built
And scaled some of the most transformative technologies in the industry. This isn’t
incremental innovation, it’s a ground-floor opportunity to rethink the optical layer from
the silicon up. You’ll work alongside a team of world-class engineers solving some of
the hardest challenges in optics, systems, and scale. Every line of code, every design
decision, every breakthrough you help deliver will shape the infrastructure of tomorrow.
If you're looking for mission, momentum, and the chance to make an outsized impact
jump on the rocket ship. We’re just getting started.
Role Overview
We are seeking a Senior Physical Design Engineer to join our silicon design team developing high-performance ASIC using TSMC advance process nodes, including 5nm and 3nm. In this role, you will own physical implementation from RTL to GDSII, drive timing and power closure for ultra-high-speed designs, and work closely with RTL, STA, IP, and verification teams to solve complex implementation challenges unique to advanced-node and high-speed transceiver architectures.
Key Responsibilities:
Physical Implementation: Own full-chip and block-level physical implementation, including floorplanning, placement, CTS, routing, and physical verification for high-speed designs in advanced TSMC nodes.
Timing, Power, and Area Closure: Collaborate closely with RTL and STA teams to ensure clean handoffs and convergent timing, area, and power closure across complex design blocks and full chip.
Advanced Physical Design: Apply physical design techniques for multi-voltage and multi-frequency domains, hierarchical implementation, physical-aware synthesis, congestion mitigation, skew optimization, and RC extraction-aware placement and routing.
Signoff and Tape out: Perform tapeout signoff activities, including PV, EM/IR, ESD and ejobview using industry-standard verification tools.
Qualifications:
Education: Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
Experience: 8+ years of hands-on physical design experience, preferably with advanced technology nodes at 5nm or below.
Physical Design Expertise: Strong experience with floorplanning, placement, CTS, routing, IR drop mitigation, timing closure, and signoff debugging.
Tools and Automation: Hands-on experience with tools such as Synopsys ICC2, RedHawk SC, Cadence Innovus, Voltus, Simens Calibre etc, along with strong scripting skills in Tcl, Python, or Perl.
Preferred Qualifications (Bonus)
High-Speed PHY Implementation: Experience with high-speed PHY such as SerDes, UCIe etc physical design implementation.
Advanced-Node Signoff: Familiarity with EM/IR analysis, power grid optimization, congestion analysis, physical verification, and tapeout signoff in advanced semiconductor process nodes.
High-Frequency Design Exposure: Experience supporting high-frequency datapath or DSP-heavy designs is a plus.
2.5D or 3D design experience: Experience with TSMC CoWoS or SoIC-X design experience is a strong plus.
What we offer
Competitive salary commensurate with experience
Comprehensive benefits package including health insurance
Professional development opportunities and certification support
Access to cutting-edge technology and cloud platforms
Collaborative work environment with cross-functional teams
*Lumilens is an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, gender, identity, orientation, veteran status, disability, or any other legally protected status.
Lumilens addresses the red hot market for AI data center infrastructure by designing, manufacturing and selling photonic interconnect solutions. We design and use custom robotics + AI in our factories to more efficiently build our products.
Lumilens is backed by top-tier venture capital investors including Mayfield and Spark Capital.
Offices: 2570 N 1st St, Suite 300, San Jose, California 95131, US
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