About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything…
Skills: Advanced Packaging Architecture, System in Package (SiP), High Bandwidth Memory (HBM), 2.5D Packaging, 3D Packaging
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About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything…
About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything…
Skills: Digital IP Design, RTL Design, Verilog, VHDL, Memory PHY
About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything…
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About SK hynix America At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything …
Skills: Computer Architecture, Memory System Architecture, System Software Design, Python, C
About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything…
Skills: Signal integrity, Power integrity, HBM, DRAM, Electromagnetics
Please Note: To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. Advancing the World’s Technology Toget…
ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technolo…
Please Note: To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. Advancing the World’s Technology Toget…
Please Note: To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. Advancing the World’s Technology Toget…
Skills: Physical design, Synthesis, Floorplanning, Placement, Clock tree synthesis
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$240k–$300k/yr
Full-time
bachelor degree, postgraduate degree
Health Insurance, Paid Time Off, Company Holidays, Happy Fridays, Paid Parental Leave Program, 401k Matching
Posted 10d ago
~40 hrs/week
Responsibilities
Lead the end-to-end development of advanced packaging system architectures with a focus on High Bandwidth Memory (HBM). Drive the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments through strategic collaborations.
Requirements
Requires a BS in Electrical Engineering with at least 7 years of specialized experience in advanced packaging architecture and a proven track record of leading engineering teams. Preferred candidates hold a Master's or PhD and possess expert knowledge of SI/PI analysis and 2.5D/3D technologies.
Full job description
About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Responsibilities:
Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
Drive mechanical and electrical test vehicle design and development when necessary.
Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.
Minimum Qualifications:
BS in Electrical Engineering or equivalent combination of education and progressive industry experience.
7+ years of specialized experience in advanced packaging architecture definition, strategy, and development.
Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred.
Exceptional verbal and written communication skills, with the ability to articulate technical strategies.
Preferred Qualifications:
Master’s degree or PhD in Electrical Engineering, Materials Science, or related field.
10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.
Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization.
Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable.
Benefits:
Top Tier health insurance at no employee cost
Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
401k Matching
Flexible Spending Account (FSA) for Health Care & Dependent Care
Educational reimbursement up to $10,000 per year
Donation Matching and volunteering opportunities
Corporate discount programs
Free Breakfast/Lunch/Dinner provided to employees
Compensation:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Pay Range
$240,000—$300,000 USD
Equal Employment Opportunity:
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:
Semiconductors are essential to all IT products, and its performance often determines the performance of the final products. SK hynix is a global leader in producing semiconductor, such as DRAM, NAND Flash and CMOS Image Sensors. With these technology driven semiconductor products, SK hynix has consistently led the industry and is now the second largest memory chip maker worldwide.
IT devices become more pervasive as new imaginative and innovative IT products continue to grab imagination and desires of consumers. SK hynix has enhanced its competency with the best level of technology and a wide range of business portfolios in order to satisfy all those demand from customers. As a member of SK Group*, SK hynix is aiming at becoming the world’s best semiconductor company. SK hynix America Inc. operates as a subsidiary of SK Hynix Inc.
*SK Group is one of South Korea's top five industrial conglomerates.
It has about 40 affiliated companies, ranging from energy, telecommunications, finance, to construction.
Offices: 3101 N. 1st St, San Jose, CA 95134, US · 4201 West Parmer Lane, Suite 280, Austin, TX 78727, US · 20333 Tomball Pkwy, Suite 380, Houston, TX 77070, US · 5511 Capital Center Drive, Suite 330, Raleigh, NC 27606, US · 10940 NE 33rd Pl, STE 204, Bellevue, Washington 98004, US
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