Espoo, Uusimaa, Finland · On-site
IQM is a global leader in designing, building, and selling superconducting quantum computers. IQM provides both on-premises full-stack quantum computers and a cloud platform to access its computers anywhere in the world.…
Skills: Solder Reflow, Microbump, Flip-chip Interconnect, Under-bump Metallizations, Solder Alloy Systems
Espoo, Uusimaa, Finland • On-site
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Develop and optimize die packaging and backend processes for superconducting quantum processor units in cryogenic environments. Lead the planning, build-out, and qualification of cleanroom expansions and process tools from concept to production readiness.
Requires a degree in Electrical Engineering, Applied Physics, or a related field with at least 3 years of cleanroom operator experience. Must have proven expertise in solder reflow, flip-chip interconnects, and die package design for extreme temperatures.
IQM is a global leader in designing, building, and selling superconducting quantum computers. IQM provides both on-premises full-stack quantum computers and a cloud platform to access its computers anywhere in the world. IQM customers include leading high-performance computing centers, research labs, universities, and enterprises with full access to IQM's software and hardware. IQM has over 300 employees with offices in Finland, Germany, France, Spain, Poland, Singapore, and the US.
(www.meetiqm.com)
We are expanding our backend and packaging activities targeting large quantum processor units (QPUs). As a Backend Process Development Engineer, you will contribute to planning and build-out of a cleanroom expansion dedicated to these processes. Your job duties will include process flow design, tool configuration, and vendor interactions. You will also have opportunities for hands-on operator work supporting process ramp-up and validation.
Your work will directly impact the performance and scalability of IQM’s superconducting quantum computers, focusing on production readiness, high reliability, and quality control.
Develop, optimize, and characterize die packaging and backend processes for cryogenic and extreme-temperature environments
Define and design backend processes from concept to production readiness
Drive process transfer to production, including documentation, training, and qualification
Specify, procure, and qualify new process tools
Support site-acceptance testing (SAT), tool installation, tool health monitoring and maintenance and ramp-up activities in collaboration with the equipment team
Contribute to cleanroom build-out together with external consultants and infrastructure teams
Perform hands-on process implementation, testing, and validation
Collaborate cross-functionally with wafer fab, QPU designers, test teams, operations, and facilities
Interface with external tool vendors to evaluate capabilities and specifications
Proven experience with solder reflow and microbump / flip-chip interconnect processes
Strong understanding of UBMs (Under-bump metallizations), and solder alloy systems
Experience in die package design for cryogenic or extreme environments
Demonstrated track record in setting up or scaling die packaging production lines
Solid knowledge of cleanroom operations, contamination control, and process qualification
Minimum 3 years of cleanroom operator experience
BSc, MSc or PhD in Electrical Engineering, Applied Physics, or a closely related field
High pad-count dies and fine-pitch interconnects
Mechanical and thermal design of die packages or interposers
Electroplating and surface finishing processes
Wave, laser, or selective soldering
Failure analysis techniques (X-ray tomography, SEM, optical microscopy)
Mask layout design for semiconducting or superconducting foundry processes
Ceramic substrates, hermetic or vacuum packaging
Microwave / RF fundamentals and impedance-controlled designs
Vacuum technologies, cryostats, or low-temperature systems
Advanced PCB design (high-frequency, rigid-flex, low-loss materials)
Automated testing, probing, or pick-and-place systems
Experience with superconducting materials or quantum device fabrication
At IQM, you can expect to work on groundbreaking quantum hardware projects. Your work will directly contribute to the development and industrialization of next-generation quantum processor units, including large-scale systems, from defining backend process concepts to bringing new tools and cleanroom capabilities online and transferring them into production.
You will thrive in a creative, open, and hands-on start-up environment where engineers are trusted with real responsibility. You will be encouraged to experiment, iterate, and continuously improve while working with cutting-edge tools and technologies.
IQM offers a highly international and collaborative workplace, bringing together experts from diverse cultural and technical backgrounds.
As a rapidly growing organization, IQM provides the opportunity to play a meaningful role in scaling both technology and operations.
Meet our people and hear more about IQM by visiting our Youtube channel here
Please note that only applications submitted through the website will be processed.
Global leader in quantum computing.
IQM is pioneering the future of superconducting quantum computers. With over $600 million raised, including the largest quantum raise outside of the US, we are the market leader in on-premises and cloud-accessible systems. IQM quantum computers empower the most innovative HPC centers, universities, enterprises, and researchers to push the boundaries of science and technology. From our headquarters in Finland and Germany and global hubs across Europe, Asia, and the U.S., our 300+ quantum explorers are advancing toward scalable, error-corrected quantum computing.
Offices: Keilaranta 19, Espoo, Southern Finland 02150, FI
There are currently 41 open science & research positions in Espoo, Finland listed on Clera. New openings are added daily as companies post roles.
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