Seremban, Negeri Sembilan, Malaysia · On-site
This role is part of the Package Development team, responsible for leading backend assembly and package platform development, including defining and executing technology roadmaps aligned with business and product needs. …
Skills: Package Design Rule Review, Thermal and Stress FEA Simulation, DFMEA, PFMEA, DFx
Kuala Lumpur, Kuala Lumpur, Malaysia · On-site
About the Role The License Desk Expert supports the organisation’s software licensing, entitlement, and compliance activities. The role acts as the central point of contact for software licence requests, allocation, rene…
Skills: Software Asset Management, IT Asset Management, License Compliance, Vendor Management, Entitlement Validation
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Lead the strategic definition and execution of package platform and backend assembly technology roadmaps to align with business objectives. Drive the development and qualification of packaging solutions from concept to mass production while coaching team members.
Requires a Bachelor's or Master's degree in Engineering with at least 10 years of semiconductor industry experience, including 3 years in management. Must possess comprehensive knowledge of assembly processes, BOM, and design technologies related to semiconductor packaging.
This role is part of the Package Development team, responsible for leading backend assembly and package platform development, including defining and executing technology roadmaps aligned with business and product needs. The role drives development from concept to mass production, ensuring reliable, manufacturable, and cost-effective solutions.
It involves resolving technical challenges, driving cross-functional collaboration, and supporting continuous improvement and new technology development. The role also includes stakeholder management and coaching team members to build technical capability and support career growth.
Leads the strategic definition and execution of package platform and backend assembly technology roadmaps, ensuring alignment with business objectives and product innovation needs.
Drives the development and qualification of assembly packaging solutions from concept to mass production.
Support teams to achieve project goals by clearing technical roadblocks.
Accountable for delivering reliable, manufacturable, and cost-effective package solutions, while influencing key technology decisions and enabling competitive advantage.
Acting as a technical leader, the role ensures strong cross-functional collaboration, drives continuous improvement, and identifies future-ready assembly technologies to sustain long-term growth.
Ensure good communication and stakeholder management.
Coaching and develop team’s technical competence and career growth.
Bachelor’s Degree/Master in Engineering.
At least 10 years of relevant experience in the semiconductor industry, with a minimum of 3 years in a managerial capacity.
The incumbent is also expected to have comprehensive knowledge on assembly process, BOM, design and equipment technologies related to semiconductor packaging.
Technical skill : Package design rule review, Thermal and stress FEA simulation , DFMEA, PFMEA , DFx (DFM, DFA, DFR) , AutoCAD, root cause analysis, DFPC, analytical tool
Strong leadership , ability to coach others.
Able to actively build up and broaden own competencies and contacts, share into the organization. Keeping up to date with state of the art packaging, material and process developments.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every commercial electronic design in the world – from automotive and industrial to mobile and consumer applications. The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards. For questions or more information about our career opportunities: [email protected] Connect with us today and become a part of TeamNexperia! Nexperia - Efficiency Wins.
Offices: Jonkerbosplein 52, Nijmegen, Gelderland 6534 AB, NL · Stresemannallee 101, Hamburg, HH 22529, DE · Bramhall Moor Lane, Pepper Rd, Hazel Grove, Stockport SK75BJ, GB · Tianmei Industrial North District A Section, Huangjiang Town, Dongguan, Guangdong 523750, CN · No.12687, Tuanku Jaafar Industrial Park, Seremban, Negeri Sembilan 71450, MY
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