Job Details: Job Description: Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies,…
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QUANTUM GLOBAL TECHNOLOGIES, LLC
CNC Operator
Hillsboro, Oregon, United States · On-site
Mid level$105K raised
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Senior
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Technical Director, Key Logic Account — Global Field Group (GFG)
Hillsboro, Oregon, United States · On-site
$176k–$242k/yr
Senior+$2.2B raised
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$99k–$140k/yr
Full-time
bachelor degree
Competitive pay, Stock bonuses, Health insurance, Retirement programs, Vacation
Posted 33d ago
~40 hrs/week
Responsibilities
The engineer is responsible for the thermal, mechanical, and electrical design and development of microelectronic packaging collaterals. They also define package performance specifications and manage technology certification through qualification plans and data collection.
Requirements
Candidates must possess a bachelor's degree in mechanical engineering or a related STEM field with at least 6 months of relevant experience. Proficiency in mechanical design tools such as CAD, SolidWorks, and finite element analysis is required.
Full job description
Job Details:
Job Description:
Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, and/or completed units.
Responsibilities include but are not limited to the following:
Responsible for the thermal/mechanical/electrical design, analysis, and development of collaterals.
Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
Conducts tests and research on basic materials and properties.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
Provides consultation concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur.
Develops solutions to problems utilizing formal education and engineering judgment.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
Candidate must possess a bachelor's degree in mechanical engineering or related STEM field and 6+ months of experience.
Experience listed above should be a combination of the following:
3+ years of experience with one or more of the following:
Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems. Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process. Stakeholder management (ex.supplier/ project management/internal partner management) Semiconductor devices and packaging processes and technology. Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Related keywords
Microelectronic packagingMechanical engineeringCADSolidWorksRSS analysisGeometric dimensioningFinite element analysisSemiconductorPick-n-placeMotion controlVision systemsThermal designElectrical designQuality assuranceStatistical design of experimentsProject management
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
• Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
.
Offices: Robert Noyce Building, Santa Clara, California 95052, US · 1 NE Jones Farm Pkwy, Hillsboro, Oregon 97124, US · 4500 S Dobson Road, OC2-257, Chandler, Arizona 85226, US · Derekh Em HaMoshavot 94, Petah Tikva, Merkaz 49000, IL · 1900 Prairie City Rd, Folsom, CA 95630, US
How much do Engineering jobs in Hillsboro, OR pay?
Based on 242 listings with disclosed salaries, most engineering jobs in Hillsboro, OR pay between $42k–$203k per year. Individual offers vary with seniority, company size, and specialization.
How many Engineering jobs are open in Hillsboro, OR right now?
There are currently 397 open engineering positions in Hillsboro, OR listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Engineering roles in Hillsboro, OR?
Companies currently hiring include Intel, Applied Materials, Entegris, QUANTUM GLOBAL TECHNOLOGIES, LLC, Lam Research, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Engineering jobs in Hillsboro, OR?
Yes — 91 of the 397 open engineering positions offer remote or hybrid work (4 remote, 87 hybrid).
How do I apply for Engineering jobs in Hillsboro, OR?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.