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Full-time
bachelor degree, postgraduate degree, professional certificate
Posted 1d ago
~40 hrs/week
Responsibilities
Drive package assembly and test development projects within the OSAT function to enable high-volume manufacturing for semiconductor products. Manage the full project lifecycle from initiation to closure, focusing on cost reduction, technology integration, and cross-functional alignment.
Requirements
Requires a Bachelor's or Master's degree in Engineering or Material Science with at least 5 years of experience in semiconductor package development and project management. Professional IPMA or PMA certification and the ability to lead global, heterogeneous teams are preferred.
Full job description
Your Role
Key responsibilities in your new role
Drive Package assembly and Test development projects under the OSAT (Outsourced Assembly & Test) function to enable turnkey/full turnkey of high volume manufacturing for Infineon's product, under Connected and Secure Systems (CSS) business division, in our subcontractors manufacturing sites present globally
Undertake low to medium complexity projects as per the project classification and category guidelines defined by Infineon
Identify package level cost down opportunities and drive cost down projects
Initiation, planning, execution, control and closure of package assembly and test development as well change management projects within the committed scope, budget and timeline
Drive package definition, technology integration and requirements engineering as part of the project initiation process
Apply Infineon’s Assembly/Global Change Management (GCM) business process, systematics and project management tools and methods to structure the projects, control, manage risks and changes throughout the project lifecycle
Responsible for operational decisions in the project and for driving the major milestone release decisions in the project review and approval platform
Work closely with cross functional project teams from various locations, to solve complex problems and identify innovative solution
Co-ordinate/support alignment of Subcon Technology roadmaps with segments and representatives of Package Technology and Innovation (PTI) function
Actively manage the project and pro-actively manage potential deviations to avert delays and additional cost
Drive package platform assessment between subcons and provide mapping to in-house capability supported by the segments and package platform managers
Close collaboration with internal partners across various functions and regions, such as from business division, package concept engineering, procurement, IT systems enabling, engineering, planning, quality, procurement, product program management and package platform management
Technical ramp up management for seamless transition during new product / package ramp up phases into serial production
Be the driver/co-driver of task force initiatives when situation arise
Foster good relationship with the resource managers from both internal, subcon business partners and drive cross functional project team members from various locations and nationalities to meet the organization goals through the project
Your Profile
Qualifications and skills to help you succeed
Master's / Bachelor's in Electrical / Electronic Engineering / Mechanical / Material Science with at least 5 years of experience in Semiconductor Package development/Manufacturing Process Knowhow. Preferably in pre-assembly, assembly, and final test process
In-depth knowledge in Project Management with more than 5 years experience leading cross-functional projects of significant complexity involving a global team of different nationality
Preferably with professional IPMA or PMA certification
Ability to solve complex problems via shaping open mind-set and cooperation in heterogeneous teams; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information
Strong interpersonal communication and reasoning skills for leading and working in matrix organization of international reach; ability to build long lasting relationships and trusted partnerships
Willing to travel
#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?
We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Related keywords
OSATSemiconductorPackage AssemblyTest DevelopmentIPMAPMAChange ManagementGCMRequirements EngineeringTurnkey ManufacturingConnected and Secure SystemsMatrix OrganizationTechnical Ramp-upCost Down ProjectsGlobal Change Management
Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.
Together, with more than 58,000 people from over 100 countries, we are not just shaping the future. We are redefining it. We engineer innovative products, while caring for our people and empowering them to reach ambitious goals. We offer work-life balance, long term growth and a supportive environment where individuality is celebrated.
#WeAreIn for driving decarbonization and digitalization. Are you in?
Offices: Am Campeon 1-12, Neubiberg, München, 85579, DE · 640 N. McCarthy Blvd., Milpitas, California 95035, US · 8 Kallang Sector, Singapore, 349282, SG · NBF Shibuya Garden Front, 3-25-18 Shibuya, Tokyo, Shibuya-Ku 150-0002, JP · No. 4, Lane 55, Chuanhe Road, Pudong, Shanghai 201210, CN
Energy EfficiencyMobilitySecuritydecarbonizationdigitalizationand Internet of ThingsElectronicsSemiconductorCommunications InfrastructureSecurity
How many Technology jobs are open in Malacca City, Malaysia right now?
There are currently 36 open technology positions in Malacca City, Malaysia listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Technology roles in Malacca City, Malaysia?
Companies currently hiring include Infineon Technologies, CelcomDigi, Singtel, SupportYourApp, TDCX, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Technology jobs in Malacca City, Malaysia?
Yes — 4 of the 36 open technology positions offer remote or hybrid work (2 remote, 2 hybrid).
How do I apply for Technology jobs in Malacca City, Malaysia?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.