#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Package Technology, you'll have the opportunity to merge creativity wi…
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Skills: Semiconductor assembly, Material science, Statistical analysis, Process development, Process control
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Skills: Semiconductor physics, Power switches, Silicon, SiC, GaN
Principal Engineer Cross Platform Technology Integration
Malacca City, Malacca, Malaysia · On-site
Senior+$5.5B raised
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Cross Platform Technology Integration, you'll have the opportunity to …
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Skills: Test development, Power discrete products, Si, SiC, Wide bandgap technologies
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Skills: Failure Analysis, Semiconductor Components, Root Cause Analysis, MOSFET, SiC Device Physics
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Staff Engineer Unit Process Development Deflashing
Malacca City, Malacca, Malaysia · On-site
Senior$5.5B raised
Identify and develop wet chemical processes (deflashing, plating) for semiconductor packages, putting process control to make sure high quality and reproducibility of the products. Your role Key responsibilities in your …
Skills: Wet chemical processes, Deflashing, Plating, Semiconductor packaging, Process control
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About the Project TSMG is looking for participants to support a large-scale Robotics AI video data collection project. You will wear a lightweight head-mounted camera while completing simple everyday or work-related task…
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Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competiveness and…
Skills: Process Development, Die Attach, PFMEA, DFMEA, Statistical Data Analysis
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Skills: Power Electronics, Product Design Implementation, Silicon Device Fabrication, Data Analysis, PJM
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow's technology. As a Senior Engineer Unit Process Engineering, you'll have the opportunity to merge creativity…
Skills: Process Engineering, Root Cause Analysis, Statistical Data Analysis, 8D Methodology, DMAIC
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Full-time
bachelor degree
Posted 1d ago
~40 hrs/week
Responsibilities
Lead the definition, design, and development of semiconductor packaging solutions from concept through to realization. Act as a technical consultant and expert to drive innovation, cross-functional collaboration, and the development of new packaging technologies.
Requirements
Requires a Bachelor's degree in Engineering or a related field and at least 10 years of experience in the semiconductor industry. Candidates must possess deep expertise in packaging, assembly, and test technologies, along with strong analytical and communication skills.
Full job description
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Package Technology, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?
Your role Key responsibilities in your new role
In this role, you will lead the definition, design, and development of semiconductor packaging solutions from concept and feasibility studies through to realization, ensuring they meet electrical, thermal, mechanical, reliability, and business requirements. You will serve as the technical expert and consultant for package design and assembly technologies, driving innovation, cross-functional collaboration, technology scouting, and knowledge creation through technical publications and patent development.
Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization
Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.) activities for package projects with major changes/new package, risks and impact
Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed
Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements
Be the contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how
Support pre development & project definition stage, and continue to be package design expert throughout project phase
Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons
Be the main contact person and technical consultant/coach for all questions and discussion regarding packaging, package design and Package
Drive innovation and pre development activities within the package platform
Consolidate the inputs for BDR and ensure the contents are updated (A project)
Generate technical papers / journals and patents related to package technology
Your profile Qualifications and skills to help you succeed
You strive to leverage deep expertise in semiconductor packaging, assembly, and test technologies, with a strong understanding of BE processes, materials, package reliability, and quality requirements to develop robust and innovative packaging solutions. You demonstrate strong analytical, communication, negotiation, and stakeholder management skills, enabling effective cross-functional collaboration and the successful resolution of complex technical and business challenges.
At least >10 years of working experience in IC/semiconductor environment
Experience in Semiconductor Packaging, Assembly and Test
Excellent technical knowledge of BE processes and materials in plastic packages and interaction to the different functions (interaction of BOM, package construction, design rules and process)
Good understanding of Automotive quality requirements and standards
Good knowledge on the internal package analysis and first level reliability
Strong analytical skills, ability to deal with conflict and ambiguity
Strong communication, negotiation skills and stakeholder management skills across all levels
Good knowledge on flip-chip technology would be advantageous
#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?
We are on a journey to create the best Infineon for everyone.
We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.
Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.
Please let your recruiter know if you need any accommodations during the interview process.
Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.
Together, with more than 58,000 people from over 100 countries, we are not just shaping the future. We are redefining it. We engineer innovative products, while caring for our people and empowering them to reach ambitious goals. We offer work-life balance, long term growth and a supportive environment where individuality is celebrated.
#WeAreIn for driving decarbonization and digitalization. Are you in?
Offices: Am Campeon 1-12, Neubiberg, München, 85579, DE · 640 N. McCarthy Blvd., Milpitas, California 95035, US · 8 Kallang Sector, Singapore, 349282, SG · NBF Shibuya Garden Front, 3-25-18 Shibuya, Tokyo, Shibuya-Ku 150-0002, JP · No. 4, Lane 55, Chuanhe Road, Pudong, Shanghai 201210, CN
Energy EfficiencyMobilitySecuritydecarbonizationdigitalizationand Internet of ThingsElectronicsSemiconductorCommunications InfrastructureSecurity
How many Science & Research jobs are open in Malacca City, Malaysia right now?
There are currently 49 open science & research positions in Malacca City, Malaysia listed on Clera. New openings are added daily as companies post roles.
Which companies are hiring for Science & Research roles in Malacca City, Malaysia?
Companies currently hiring include Infineon Technologies, allnex, Rentokil Initial, TSMG Holding, among others. Browse the listings above to see every active employer.
Are there remote or hybrid Science & Research jobs in Malacca City, Malaysia?
Yes — 1 of the 49 open science & research positions offer remote or hybrid work (0 remote, 1 hybrid).
How do I apply for Science & Research jobs in Malacca City, Malaysia?
Each listing links directly to the employer's application page. Apply early — fresh listings get the most recruiter attention in the first two weeks.