Job Description [Hiring Background] Reneas has set a goal of achieving over USD 20 billion in revenue by 2035 and will continue to expand the possibilities of advanced semiconductor solutions. Building on this vision, ou…
Skills: Power Mos, Process Development, Device Development, Wafer Process, Automotive Applications
Job Description [Hiring Background] Reneas has set a goal of achieving over USD 20 billion in revenue by 2035 and will continue to expand the possibilities of advanced semiconductor solutions. Building on this vision, ou…
Skills: Wafer Process Development, Power MOS, IPD, Automotive Safety Standards, ISO 26262
Job Description [Hiring Background] Reneas has set a goal of achieving over USD 20 billion in revenue by 2035 and will continue to expand the possibilities of advanced semiconductor solutions. Building on this vision, ou…
Skills: Wafer Process Development, Power MOS, IPD, Process Roadmap Definition, Automotive Safety Standards
Job Description 1. Facilitate process change review via physical meeting or system. 2. Coordination with cross functional team to achieve internal approval as well as customer approval. 3. KPI tracking in periodic basis.…
Skills: Process Change Review, Cross Functional Coordination, KPI Tracking, Manufacturing Process Change Control, Quality Assurance
Mid-end and backend process technology (WET/Integration/Metal deposition/Lithography engineer)
Kodaira, Japan · Hybrid
Mid level
Job Description SPS (Smart Power Stage) products are expected to see significant demand growth from 2025 to 2030, with a particular surge in demand for AI servers. These devices, especially embedded VPS such as PT (Power…
Skills: Wet Process Development, Semiconductor Integration, Metal Deposition, Lithography, Process Improvement
Chief of Staff to VP, HPC Hardware Engineering (HWEN)
Kodaira, Japan · Hybrid
Senior+
Job Description Executive Summary The Chief of Staff serves as the primary leadership partner to the Head of HWJP and plays a key role in improving how HWJP operates. This role strengthens transparency, governance, decis…
Skills: Engineering Operations, Program Management, Business Operations, Strategic Planning, Stakeholder Management
Job Description Position Overview The GaN Layout Tape-Out Support Engineer is responsible for end-to-end tape-out execution for Gallium Nitride (GaN) technologies. This role supports multiple concurrent tape-out flows, e…
Skills: GaN Layout, Tape-Out Execution, Cadence, Calibre, Unix/Linux
Job Description 【Background】 This team support SPS FET design for PCP. In the last year, two out of the four device engineers who no longer with the company. We are aslo supporting the new MV FET REXFET2 and REXFET3. The…
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Full-time
Posted 8d ago
~40 hrs/week
Responsibilities
The role involves leading the development of documentation workflows and hardware manuals for automotive SoCs to improve efficiency and reduce human error. You will be responsible for defining improvement plans, managing requirements and traceability, and overseeing documentation across multi-site development teams.
Requirements
Candidates must have experience in managing digital front-end LSI design teams and writing technical specifications for LSI/IP. Proficiency in English communication is required, while knowledge of scripting languages like Python and SoC-related IP is highly desirable.
ルネサスは、「To Make Our Lives Easier(人々の暮らしをより豊かで快適にする)」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
Offices: TOYOSU FORESIA, 3-2-24, Koto-ku, Toyosu, Tokyo 135-0061, JP