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Skills: Wafer Process Development, Power MOS, IPD, Automotive Safety Standards, ISO 26262
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Job Description [Hiring Background] Reneas has set a goal of achieving over USD 20 billion in revenue by 2035 and will continue to expand the possibilities of advanced semiconductor solutions. Building on this vision, ou…
Skills: IPD Process Development, Power MOS Development, Wafer Process Roadmap, Automotive Safety Standards, AEC-Q100/012
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Full-time
Remote Work Options, Inclusive Workplace Environment, Global Support System, Career Development Opportunities
Posted 12d ago
~40 hrs/week
Responsibilities
Lead the end-to-end delivery of wafer process development and define the process roadmap for Intelligent Power Devices (IPD). Collaborate with development teams to ensure reliable process releases that meet automotive safety and quality standards.
Requirements
Requires 8-10+ years of experience in IPD or Power MOS process/device development with a proven track record of technical leadership. Must possess extensive knowledge of automotive fault cases, reliability requirements, and Power MOS driving methods.
Full job description
Job Description
[Hiring Background]
Reneas has set a goal of achieving over USD 20 billion in revenue by 2035 and will continue to expand the possibilities of advanced semiconductor solutions.
Building on this vision, our division is focusing on Intelligent Power Devices (IPD), where the market continues to grow and is taking on the challenge of further expanding our product portfolio.
We are now looking for an experienced leader in the IPD field who can define and drive our specific process roadmap for the IPD product line to enable the optimal process for the development team to provide the best in business products.
Our team values a culture in which members respect and elevate each other's expertise while growing together.
We look forward to applications from candidates who can leverage their past experiences and skills to make a major impact to our division.
[Role Responsibilities]
・Own end-to-end delivery of wafer process development, ensuring robust, scalable, and reliable process release that meets quality, cost, and schedule targets.
・Define the product groups process roadmap. Assessing the present capability and identitying key advancements that will advance the technology for the various IPD product lines
・Includes specification defination that balance design difficulty with market IPD requirements (process tailored for IPD products that will benefit product and design flexibility).
・Understand the mid to long-term wafer process roadmap and contribute to formulating the technology strategy.
・As a technical leader in wafer process development, drive the development in collaboration with the process development team to ensure the reliable release of the processes that meet all requirements.
・Understand reliability and safety standards required for automotive applications (AEC-Q100/012, functional safety ISO 26262, etc.) and reflect them appropriately in the wafer process specification.
・Manage development schedule, cost, risk, and commit to achieving group targets.
・Support wafer process evaluation, analyzing root causes of unexpected results or failures and driving them through to resolution.
・Lead risk identification and mitigation strategies, proactively addressing technical and program risks to ensure predictable execution.
・Mentor and develop less-experienced team members, contributing to raising the overall technical capability of the organization.
Qualifications
[MUST]
・8–10+ years of experience in IPD or Power MOS process/device development
・Experience as a development leader for process/device development, leading multiple developments
・Extensive knowledge of Power MOS (structure and characteristics) & preferrably FETs used in IPD applications
・Extensive knowledge of Power MOS driving methods used in IPDs
・Extensive knowledge of Fault cases and loading for automotive applications
・Extensive knowledge and experience for rlationship between reliability requiremnt & process/device design
・Deternination of target specification such as EAS, IAS, TSOA,… & problem solving ability
[WANT]
・Experience and knowledge of CMOS process
・Experience and knowledge of TCAD
・Experience and knowledge of EMC/ESD
・Knowledge of package technology
・Knowledge of semiconductor physics
・Knowledge of thermal design
Additional Information
ルネサスは、「To Make Our Lives Easier(人々の暮らしをより豊かで快適にする)」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
Offices: TOYOSU FORESIA, 3-2-24, Koto-ku, Toyosu, Tokyo 135-0061, JP