Technical Lead, Custom Digital Circuit Design, Mixed Signal
Haifa, Haifa District, Israel · On-site
$240k–$333k/yr
Senior+$26M raised
Minimum qualifications: Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience. 12 years of experience in Physical Design, Custom Digital Circuit …
Skills: Physical Design, Custom Digital Circuit Design, Custom Layout, GDS, Low Power Design
Minimum qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience. 10 years of industry experience in embedded systems/firmware, comm…
Skills: Embedded systems, Firmware development, Digital signal processing, C++, C
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the fu…
Skills: Lab operations, Hardware engineering, System validation, Semiconductor industry, ASIC
Mobileye is looking for a Signal Integrity Engineer to join AV group and develop of the next generation of Autonomous Driving products. Mobileye is a leading innovator in the automotive industry, dedicated to delivering …
Skills: Signal Integrity, Power Integrity, Simulation, HyperLynx, ANSYS
Annapurna Labs, an Amazon company, designs and delivers high-end, custom silicon that sits at the very heart of AWS. Our devices don't just support the cloud - they actively define it. From Trainium, the purpose-built ma…
Skills: C, C++, Chip validation, Software development, System level software
הזדמנות לעמוד בחזית תחום המכשור והחשמל באתר דשנים להבטיח את הרציפות התפעולית של המפעל, לאמינות הציוד ולבטיחות העובדים התפקיד בעל השפעה ניהולית וטכנולוגית המשלב הובלת צוות מקצועי, אחריות על תשתיות חשמל ומכשור קריטיות ויכו…
Skills: Electrical Engineering, Instrumentation, Control Systems, Team Management, Project Management
הזדמנות לקחת חלק בהפיכת רעיונות וחדשנות לתהליכים תעשייתיים אמיתיים. בתפקיד תוביל/י מעבר של תהליכים חדשניים משלב המעבדה אל הפיילוט והייצור, תעבוד/י עם מגוון רחב של טכנולוגיות ותשפיע/י באופן ישיר על פיתוח מוצרים ותהליכים ב…
Skills: Chemical Engineering, Process Development, Pilot Plant Operation, P&ID, Process Simulation
Annapurna Labs, an Amazon team, designs and delivers high-end, custom silicon at the heart of AWS. Our chips don't just support the cloud — they define it. From Trainium, the purpose-built ML accelerator driving the next…
Skills: Physical Design, RTL2GDS, Floorplanning, Synthesis, Clock Tree Synthesis
Job Details: Job Description: This is a student position, operating cutting-edge test equipment [ATEs, systems] and technology in a dynamic lab environment The role requires applying knowledge across electronics, softwar…
SOC Quality and Reliability Engineer, Google Cloud
Haifa, Haifa District, Israel · On-site
Mid level$26M raised
Minimum qualifications: Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience. 4 years of experience in Integrated Circuit (IC) silicon quality or …
Minimum qualifications: Bachelor's degree in Computer Science, Computer Engineering, a relevant technical field, or equivalent practical experience. 5 years of experience coding in C/C++. Experience with embedded systems…
Minimum qualifications: Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 1 year of experience with digital logic design principl…
Skills: Digital logic design, RTL design, Verilog, SystemVerilog, Lint
Minimum qualifications: Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 4 years of experience in embedded code development (e.g…
Skills: DDR PHY, Memory Controller, Post-silicon validation, C, C++
SoC Quality and Reliability Engineer, Google Cloud
Haifa, Haifa District, Israel · On-site
Senior$26M raised
Minimum qualifications: Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience. 8 years of experience in IC silicon quality or reliability. Experien…
Senior Verification Engineer, Digital Signal Processing, Google Cloud
Haifa, Haifa District, Israel · On-site
Senior$26M raised
Minimum qualifications: Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field, or equivalent practical experience. 8 years of experience in design verification with a focus on mi…
Job Details: Job Description: Who We Are? Intel's AI Solutions Group is at the forefront of innovation, delivering state-of-the-art AI capabilities that power Intel's global chip development. Our team of over 250 AI Engi…
Skills: Artificial Intelligence, Machine Learning, Big Data, Data Analysis, Product Analysis
Annapurna Labs, an Amazon team, designs and delivers high-end, custom silicon at the heart of AWS. Our chips don't just support the cloud — they define it. From Trainium, the purpose-built ML accelerator driving the next…
Skills: Physical design, RTL2GDS, Floorplanning, Synthesis, Clock tree synthesis
Experienced Deep Learning Optimization Engineer- Compilers Team
Haifa, Haifa District, Israel · Hybrid
Mid level$3.0B raised
Mobileye is the world leader in automotive and driving assistance systems, developing the world's most advanced software technologies and hardware architectures. Mobileye is providing an end-to-end software solution for …
ייזום וניהול פרויקטים בהנדסת אלקטרוניקה. ניהול ומעקב ביצוע אחזקה מונעת ומתוכננת בהנדסת אלקטרוניקה. בדיקת תוכניות לפרויקטים והכנה חוות דעת הנדסיות. קליטה והטמעה של טכנולוגיות חדשות ומתחדשות בתחום. ייצוג וקשר עם גורמים ממט…
Company:Qualcomm Israel Ltd. Job Area:Engineering Group, Engineering Group > Systems Engineering General Summary: This position can be in Haifa or Hod HaSharon Qualcomm’s offices Be part of a team responsible for designi…
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$240k–$333k/yr
Full-time
bachelor degree, postgraduate degree
Bonus, Equity, Health Insurance
Posted 5h ago
~40 hrs/week
Responsibilities
Define global back-end and custom physical design methodologies while leading full custom digital circuit design at the transistor level. Act as the primary liaison with foundries to optimize design for manufacturing and ensure high-speed performance for TPU-scale chips.
Requirements
Requires a bachelor's degree in a technical field and at least 12 years of experience in physical design or custom digital circuit design. Candidates should have experience delivering GDS for advanced nodes and expertise in low power design techniques.
Full job description
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
12 years of experience in Physical Design, Custom Digital Circuit Design, or Custom Layout.
Experience delivering GDS for advanced nodes.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience in custom digital design and low power design techniques.
Experience with custom design tools and methods.
Experience in Electromagnetic Modeling (EM) and its impact on physical layout (Inductors, T-lines).
Experience in Co-Packaged Optics (CPO) physical implementation.
Ability to build strategic goals for the intersection of AI-driven layout and traditional custom design.
About the job:
In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As the Lead Architect for Google’s custom back-end solutions for high-speed internal connections, you will set the design standards for our custom silicon. You will ensure our physical design methods can support data speeds of 1.6T and above while maintaining high manufacturing reliability and performance. You will create the design framework for our future hardware, solving complex engineering challenges in the latest manufacturing processes.
The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.
We're the driving team behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Define the global back-end and custom Physical Design methodology, driving the transition to automated Analog and Mixed-Signal (AMS) flows and "Layout-Aware" design.
Lead full custom digital circuit design at the transistor level optimized for low power.
Evaluate and de-risk new process features in GAA (Gate-All-Around) nodes (e.g., Backside Power Delivery, Buried Power Rails) for high-speed analog use cases.
Drive the long-term Roadmap for Area and Power density, ensuring our PHYs remain the most efficient in the industry.
Act as the primary liaison with foundries to optimize Design for Manufacturing (DFM) and maximize yield for massive TPU-scale chips.
Related keywords
Physical DesignCustom Digital Circuit DesignMixed SignalGDSAdvanced NodesLow Power DesignElectromagnetic ModelingCo-Packaged OpticsAI-driven LayoutTPUTensor Processing UnitSilicon SolutionsBack-endAnalog and Mixed-SignalGAAGate-All-Around
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