Fort Collins, Colorado, United States · On-site
$20/hr–$22/hr
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Skills: Wafer Fabrication, Product Testing, Safety Protocol Adherence, Team Leadership, Troubleshooting
Irvine, California, United States · On-site
$110k–$176k/yr
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Skills: Finite Element Analysis (FEA), Thermo-mechanical Simulation, Ansys Mechanical, Ansys APDL, Python
Bengaluru, Karnataka, India · On-site
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Skills: System Verilog, UVM, VMM, PCI Express, AXI
Hsinchu, Taiwan · On-site
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Skills: Foundry Engineering, FEOL, MEOL, BEOL, AI/ML Integration
Bengaluru, Karnataka, India · Remote OK
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Skills: Kubernetes, VMware Cloud Foundation, Application Modernization, Cloud-Native Platforms, vSphere
Breinigsville, Pennsylvania, United States · On-site
$110k–$176k/yr
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Skills: Optical Device Testing, Python, C++, C#, Multi-threaded Software
San Jose, California, United States · On-site
$122k–$195k/yr
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Skills: IC Design, RTL Synthesis, Timing Analysis, Verilog, TCL
Lisle, Illinois, United States · On-site
$110k–$176k/yr
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Skills: Mainframe Development, JCL, Python, JSON, REXX
Irvine, California, United States · On-site
$122k–$195k/yr
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Skills: Teradyne UltraFlex, ATE Test Development, Test Hardware Development, PCB Design, Debug and Bring-up
Lisle, Illinois, United States · On-site
$110k–$176k/yr
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Skills: z/OS Mainframe, REXX Scripting, SMF Records, Mainframe Debugging, Network Security Protocols
Irvine, California, United States · On-site
$110k–$176k/yr
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Skills: Analog Layout, RF Layout, FinFET, Cadence Virtuoso, Mentor Calibre
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: Siemens Tessent, DFT Architecture, DFT Integration, ATPG, ATE Interface
Penang, Malaysia · On-site
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Skills: Data Analysis, Reporting, Process Improvement, Account Management, Excel
Hsinchu, Taiwan · On-site
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Skills: IC Substrate Manufacturing, NPI Activity, Risk Assessment, Process Improvement, Packaging Technology
Seoul, South Korea · On-site
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Skills: RF Module Design, Hardware Development, Project Management, Integrated Circuitry, DSP Systems
Penang, Malaysia · On-site
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Skills: IC Design, ASIC Development, Technical Management, Analog Design, Digital Design
Singapore, Singapore · On-site
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Skills: Epi Wafer Growth, Tool Changeover, Chemical Handling, Total Productive Maintenance, Equipment Cleaning
Singapore, Singapore · On-site
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Skills: Analog Design, Opto-electronics Design, Power MOSFET Design, Semiconductor Product Characterization, Yield Analysis
Breinigsville, Pennsylvania, United States · On-site
$110k–$176k/yr
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Skills: Ion Beam Sputtering, Thin-film Deposition, Process Integration, Statistical Process Control, Design of Experiments
Plano, Texas, United States · On-site
$129k–$207k/yr
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Skills: Pre-sales, Technical Guidance, Implementation Consulting, Post-sales Lifecycle Support, VMware Cloud Foundation
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Performs various functions in semiconductor device production using fabrication tools and testing processes. Collaborates in a team environment to achieve production goals while strictly following safety protocols.
Requires a high school diploma or GED, with previous manufacturing experience preferred. Must be able to stand for 8-10 hours and work in a full-body cleanroom suit.
Please Note:
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2. If you already have a Candidate Account, please Sign-In before you apply.
Work day is 12.0 hours alternating between 3 and 4 day work weeks.
A Shift schedule is 6:00am-6:00pm Sun, Mon, Tue, every other Wed
B Shift schedule is 6:00am-6:00pm Thu, Fri, Sat, every other Wed
C Shift schedule is 6:00pm-6:00am Sun, Mon, Tue, every other Wed
D Shift schedule is 6:00pm-6:00am Thu, Fri, Sat, every other Wed
Applicants for night shift openings (working 6:00pm-6:00am) strongly preferred.
Typically 8-10 hours per day are spent standing and walking while continuously lifting and moving boxes of wafers weighing approximately 10 lbs. Work time is spent in a cleanroom environment wearing a full body, head to foot, cleanroom suit. Additional Personal Protective Equipment must also be worn when handling or working indirectly with hazardous materials.
- Job Summary:
Performs a variety of functions in the production of semiconductor devices that include using wafer fabrication tools and processes, testing product, and delivering product to work areas. Must have an uncompromising dedication to following safety procedures and protocol. Uses written procedures and process specifications in completing assignments. Works collaboratively and professionally in a team environment to achieve production goals.
- Skill:
Leads in a team environment to maximize quality and throughput in a safe manner. Has an understanding of customer and vendor relationships within the factory. Ability to train team members to process and equipment procedures. Applies knowledge of semiconductor manufacturing to avoid quality issues. Depth of tool knowledge enables highly productive use of equipment sets and proactive management of tool issues.
- Job Complexity:
Works on assignments that may be complex in nature, requiring judgment and troubleshooting skills. Basic process decision-making required. Assignments may span multiple work areas. Uses broad job knowledge to drive operating improvements.
- Supervision:
Ability to work with minimal supervision. May take team leadership roles to coordinate activities on a daily basis.
- Experience:
· High School diploma or equivalent or GED.
· Previous manufacturing experience preferred
Compensation and Benefits
The salary range for this position is $20.50 - $22.00 per hour.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Offices: 3401 Hillview Ave, Palo Alto, California 94304, US
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Offices: 3401 Hillview Ave, Palo Alto, California 94304, US
