San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: Physical IC Design, Synthesis, Physical Verification, Timing Closure, EM/IR Analysis
San Jose, California, United States · On-site
$101k–$162k/yr
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Skills: IBM Assembler, z/OS, Agile, Endevor, GitHub
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: ASIC Design, SystemVerilog, Verilog, RTL Design, Static Timing Analysis
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: System Verilog, UVM, ASIC Design Verification, RTL Verification, OVM
Irvine, California, United States · On-site
$144k–$230k/yr
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Skills: Physical Design, Static Timing Analysis (STA), Design For Test (DFT), Packaging, PPA Tradeoffs
Durham, North Carolina, United States · On-site
$104k–$167k/yr
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Skills: Agile Product Ownership, Backlog Grooming, Stakeholder Management, User Story Creation, Strategic Execution
Tel Aviv, Tel-Aviv District, Israel · On-site
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Skills: SI/PI, Board Level Debugging, High Speed Digital Design, DDR, PCIe
Irvine, California, United States · On-site
$129k–$207k/yr
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Skills: Constrained Random Verification, System Verilog, UVM, OOP, Coverage Closure
San Jose, California, United States · On-site
$168k–$268k/yr
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Skills: Advanced Packaging Technology, System In Package Assembly, Semiconductor Device Fabrication, Reliability Failure Mechanisms, Wafer Foundry Manufacturing
San Jose, California, United States · On-site
$110k–$176k/yr
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Skills: AI Integration, LLM Agents, MCP Protocol, VLSI Design Systems, AI/ML System Development
Shanghai, Shanghai, China · On-site
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Skills: Physical Design, Floor Planning, Placement, Design Closure, STA
Shanghai, Shanghai, China · On-site
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Skills: Physical Design, Floor Planning, Placement, Design Closure, STA
Fort Collins, Colorado, United States · On-site
$73k–$117k/yr
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Skills: Mechanical Design, Industrial System Maintenance, Troubleshooting, Project Management, Siemens Building Automation Systems
Austin, Texas, United States · On-site
$127k–$226k/yr
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Skills: PyTorch, JAX, OpenXLA, C++, Python
Melville, New York, United States · On-site
$90k–$144k/yr
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Skills: Financial Analysis, Business Process Improvement, Data Analysis, Strategic Planning, Stakeholder Management
Penang, Malaysia · On-site
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Skills: RF Product Engineering, NPI Integration, Electrical Test Data Analysis, Failure Analysis, AI-Driven Automation
Fort Collins, Colorado, United States · On-site
$110k–$176k/yr
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Skills: Defect Analysis, Statistical Process Control (SPC), Klarity, JMP, Root Cause Analysis
Irvine, California, United States · On-site
$110k–$176k/yr
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Skills: Project Management, Greenfield Factory Construction, Advanced Packaging, Semiconductor Manufacturing, Heterogeneous Integration
Singapore, Singapore · On-site
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Skills: IC Product Validation, Mixed Signal Validation, Analog IC Design, Test and Measurement Setup, Hardware Debugging
Boston, Massachusetts, United States · On-site
$100k–$160k/yr
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Skills: Mainframe Infrastructure, Broadcom Software, REXX, COBOL, HLASM
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The role involves executing the full physical design cycle from RTL to silicon tape-out for AI, ML, and Enterprise Storage products. Key tasks include synthesis, timing closure, EM/IR analysis, and collaborating with RTL engineers to develop flow methodologies.
Candidates must have a Bachelor's degree in Electrical or Electronics Engineering and over 12 years of relevant experience. Proficiency in TCL/PERL scripting and a deep understanding of EDA tools for the full physical design cycle are required.
Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Broadcom is searching for a Physical IC Design Engineer to join the Asic Products Division. This position involves working with the latest technology to continue driving next generation Artificial Intelligence and Machine Learning ecosystems through our PCIe Switch Products – and managing mega datacenters, while leading world class performance, through our Enterprise Storage Products. More specifically, this position will require in-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape-out.
Execution of Physical Design, Synthesis, Physical Verification, and Timing Closure
Setup and Synthesizing RTL
Timing closure through various methods and strategies
EM/IR Analysis
Place and Route
Clock Tree Synthesis
Floor-planning and Layout
Flow and Methodology Development
Collaborating with IC Design RTL Engineers
Must work in person at our San Jose site: no remote work allowed.
TCL/PERL Scripting
Proficiency in related EDA Tools
Full physical design cycle experience: RTL to Tape-out
Excellent verbal and written communication skills
Minimum: Bachelor’s degree required in Electrical Engineering or Electronics Engineering
12+ Years of relevant experience
Compensation and Benefits
The annual base salary range for this position is $143,800 - $230,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Offices: 3401 Hillview Ave, Palo Alto, California 94304, US
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Offices: 3401 Hillview Ave, Palo Alto, California 94304, US
