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Full-time
bachelor degree
Posted 18h ago
Apply by Dec 31
~40 hrs/week
Responsibilities
The Field Applications Engineer is responsible for commissioning equipment at customer sites and ensuring process performance meets acceptance standards. They also provide technical troubleshooting and conduct training for customers to ensure system functionality.
Requirements
Candidates must hold a relevant science or engineering degree and possess significant experience in the semiconductor industry. Proficiency in thin film measurement and specific deposition or etch processes is required.
Full job description
Role Details
Business, Location:
ServiceDelivery, China
Role:
Field Applications Engineer
Reports to:
Field Applications Manager - PT China
Direct Reports:
None
Primary Purpose:
Working closely with others, ensure that OIPT equipment is fully functional and available for customer use.
Key Responsibilities
Process commissioning: Demonstrate process performance of tools installed at customer’s sites to pass customer acceptance tests and achieve system acceptance. This could involve foreign travel.
Troubleshooting: Provide technical process troubleshooting and connection with customers.
Training: Carry out customer training both at customer sites
Indicative Performance Measures
Customer acceptance of the process performance of installed tools in field.
Met all key objectives on all and over achieve on most field acceptance jobs
“On target”– successfully achieved objectives
“Mostly achieved”– targets missed in one or two areas
Results not achieved in a number of areas or few areas of high impact
Person Specification – Essential requirements unless stated
Education / Qualifications:
A relevant science or engineering degree. Physical or EE engineering.
Significant experience of the semiconductor industry or relevant experience in an academic institution.
Professional Skills/ Abilities:
Abilities:
Excellent written and oral communication.
Thin film measuring skills (e.g. SEM, stress and RI)
Skills : General deposition and/or etch experience, if have below two processes capability, that will be better.
Ion Beam (Deposition and / or Etch)
Deposition: PECVD, ICP CVD and ALD
Etch: RIE, ICP and FA
Personal Qualities:
Plans effectively in order to meet business objectives
Plans own time to maximum effect,
Highly innovative and good lateral thinking skills for identifying opportunities for technology development applications.
Willingness to take on responsibility
Willingness to travel Field acceptance.
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Related keywords
Field Applications EngineerSemiconductorProcess commissioningCustomer acceptanceTroubleshootingThin filmSEMStressRIDepositionEtchIon beamPECVDICP CVDALDRIE
Oxford Instruments is a leading provider of high technology tools and systems for research and industry. We design and manufacture equipment that can fabricate, analyse and manipulate matter at the atomic and molecular level.
Our purpose is to accelerate the breakthroughs that create a brighter future for our world.
Offices: Halifax Road, High Wycombe, England HP12 3, GB · 300 Baker Ave, Suite 140, Concord, MA 01742, US · Borsigstraße 15a, Wiesbaden, Hesse 65205, DE · Govier Way, Western Approach Distribution Park, Severn Beach, England BS35 4GG, GB · 360 El Pueblo Rd, Scotts Valley, California 95066, US
Benchtop NMREtchingDeposition and GrowthMicroanalysisX-ray FluorescenceOptical EmissionCoating ThicknessMRI and CT SystemsX-ray TubesPlasma Etch and Deposition
Oxford Instruments is a leading provider of high technology tools and systems for research and industry. We design and manufacture equipment that can fabricate, analyse and manipulate matter at the atomic and molecular level.
Our purpose is to accelerate the breakthroughs that create a brighter future for our world.
Offices: Halifax Road, High Wycombe, England HP12 3, GB · 300 Baker Ave, Suite 140, Concord, MA 01742, US · Borsigstraße 15a, Wiesbaden, Hesse 65205, DE · Govier Way, Western Approach Distribution Park, Severn Beach, England BS35 4GG, GB · 360 El Pueblo Rd, Scotts Valley, California 95066, US
Benchtop NMREtchingDeposition and GrowthMicroanalysisX-ray FluorescenceOptical EmissionCoating ThicknessMRI and CT SystemsX-ray TubesPlasma Etch and Deposition