Chandler, Arizona, United States · Hybrid
$134k–$189k/yr
Job Details: Job Description: Intel is seeking a Substrate Packaging Research and Development Engineer to join our Packaging Technology Development organization. In this role, you will develop innovative assembly process…
Skills: Materials science, Mechanical engineering, Electrical engineering, Chemical engineering, Organic chemistry
Chandler, Arizona, United States · On-site
$84k–$167k/yr
Job Details: Job Description: Join Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work …
Skills: Project management, Construction management, Semiconductor manufacturing, Equipment installation, Commissioning
Bengaluru, Karnataka, India · On-site
Job Details: Job Description: Intel IP Program Office is seeking a Software Engineer to build world class applications that enable Intel Foundry to securely manage, process, and share proprietary data. This role focuses …
Skills: Software Engineering, Python, Java, C++, Ruby On Rails
Phoenix, Arizona, United States · Hybrid
$168k–$330k/yr
Job Details: Job Description: The IT organization is seeking a Director/Senior Manager of Business Operations to lead a centralized team supporting Global IT segments. This role is critical to driving financial execution…
Skills: Financial planning, Budgeting, Strategic decision-making, Data analysis, Project management
United Kingdom · Remote OK
Job Details: Job Description: The Role and Impact As an experienced Developer Technology Engineer, you will play a pivotal role in shaping the future of Intel's cutting-edge graphics and computing technology. Working at …
Skills: GPU, CPU, Game engine architecture, Rendering pipelines, HLSL
Albuquerque, New Mexico, United States · On-site
$49k–$54k/yr
Job Details: Job Description: If you are a "hands on" person and you like the rush and excitement of producing the technology that will enable the life of every person on earth, keep reading! The NM APTM (New Mexico Adva…
Skills: Equipment Setup, Production Monitoring, Quality Checks, Troubleshooting, Production Optimization
Santa Clara, California, United States · Hybrid
$215k–$441k/yr
Job Details: Job Description: The Role and Impact As a Sales Account Manager, you will play a pivotal role in driving Intel's growth by cultivating relationships, uncovering business opportunities, and closing design win…
Skills: Sales account management, Business development, Technical expertise, Strategic planning, Relationship management
Chandler, Arizona, United States · On-site
$121k–$171k/yr
Job Details: Job Description: As a Quality Program Engineer (QPE) for the Chandler Assembly site, you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel's Quality and Reliability organization. You will …
Skills: Program management, Quality management, Audit, 8D, FMEA
Penang, Malaysia · On-site
Job Details: Job Description: As a Semiconductor Manufacturing Engineer. you will play a vital role in driving Intel's manufacturing excellence and contributing to the success of production facilities. You will lead a te…
Skills: Semiconductor Manufacturing, Lean Manufacturing, Team Leadership, Operational Management, Problem Solving
Hillsboro, Oregon, United States · On-site
$211k–$298k/yr
Job Details: Job Description: Manufacturing Development and Customer Engineering (MDCE) is a strategic organization within Intel Foundry Technology Manufacturing focused on improving process capability across Intel's tec…
Skills: Chemical Mechanical Planarization, CMP process development, Process optimization, High-volume manufacturing, Root-cause analysis
Penang, Malaysia · On-site
Job Details: Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization…
Skills: Manufacturing equipment, Process engineering, Integrated circuits, Device miniaturization, Equipment maintenance
Folsom, California, United States · Hybrid
$188k–$266k/yr
Job Details: Job Description: Join Us in Shaping the AI Era at Intel We are building a pioneering AI and Data organization within IT to drive a fundamental transformation across Intel. This is your chance to be at the ce…
Skills: Product management, IT software delivery, Generative AI, Agentic AI, Gemini Enterprise
Kulim, Kedah, Malaysia · On-site
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies nove…
Skills: Semiconductor assembly, Packaging technology, Thermal engineering, Fluid dynamics, Process engineering
Folsom, California, United States · Hybrid
$122k–$232k/yr
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experienc…
Skills: Physical design, Synthesis, Place and route, Timing closure, Layout closure
Santa Clara, California, United States · On-site
$122k–$232k/yr
Job Details: Job Description: Join us to help build the next generation of AI hardware solutions. You will be part of a highly skilled, agile team developing cutting-edge hardware for the AI domain, where we push the bou…
Skills: Reliability engineering, FMEA, RAS, Statistical reliability, Weibull
Penang, Malaysia · On-site
Job Details: Job Description: Performs electrical or mechanical troubleshooting to determine problems in non-functioning equipment used in the manufacturing process.Dismantles, adjusts, repairs, and installs/assembles eq…
Skills: Electrical troubleshooting, Mechanical troubleshooting, Equipment maintenance, Calibration, Data analysis
Zapopan, Jalisco, Mexico · Hybrid
Job Details: Job Description: This position requires candidates to upload a resume in English. We are seeking a motivated and detail-oriented SoC Functional Validation Intern to join our SoC validation team. In this role…
Skills: SoC Functional Validation, Python, C, C++, Linux
Worcester, Massachusetts, United States · Hybrid
$106k–$149k/yr
Job Details: Job Description: The Role and Impact In this role, you will be part of the SoC Logic Design Engineering team, contributing to the design and integration of next-generation Xeon server product SoCs and IPs. Y…
Skills: System Verilog, RTL design, SoC integration, Logic development, Synopsys VCS
Hillsboro, Oregon, United States · Hybrid
$156k–$298k/yr
Job Details: Job Description: The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid b…
Skills: Hybrid bonding, Wafer bonding, Advanced packaging, Process development, Equipment engineering
George Town, Penang, Malaysia · Hybrid
Job Details: Job Description: The Role and Impact As a System Software Architect, you will play a pivotal role in defining and designing end-to-end system software solutions tailored to specific technologies, products, p…
Skills: System Software Architecture, Software Engineering, C#, SQL, TypeScript
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The engineer will develop innovative assembly processes and equipment solutions to support Intel's future packaging technology roadmap. They are responsible for driving process development, ensuring manufacturing excellence, and maintaining quality and reliability standards for advanced packaging.
Candidates must hold a PhD in a relevant engineering or science field and possess at least two years of experience in data analysis and experimental design. Proficiency in material characterization and statistical process control is essential for this role.
Intel is seeking a Substrate Packaging Research and Development Engineer to join our Packaging Technology Development organization. In this role, you will develop innovative assembly processes and equipment solutions that enable Intel’s future packaging technology roadmap. You will be responsible for driving process development, equipment optimization, package reliability, and manufacturing excellence for advanced package assembly technologies.
The successful candidate will leverage engineering fundamentals, experimental design, statistical analysis, and problem-solving skills to develop and qualify new packaging solutions while ensuring quality, reliability, manufacturability, and cost competitiveness.
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.
This role requires regular onsite presence to fulfill essential job responsibilities.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop .
Offices: Robert Noyce Building, Santa Clara, California 95052, US · 1 NE Jones Farm Pkwy, Hillsboro, Oregon 97124, US · 4500 S Dobson Road, OC2-257, Chandler, Arizona 85226, US · Derekh Em HaMoshavot 94, Petah Tikva, Merkaz 49000, IL · 1900 Prairie City Rd, Folsom, CA 95630, US
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop .
Offices: Robert Noyce Building, Santa Clara, California 95052, US · 1 NE Jones Farm Pkwy, Hillsboro, Oregon 97124, US · 4500 S Dobson Road, OC2-257, Chandler, Arizona 85226, US · Derekh Em HaMoshavot 94, Petah Tikva, Merkaz 49000, IL · 1900 Prairie City Rd, Folsom, CA 95630, US
