Berlin, Germany · On-site
Deine Aufgaben Ziel der Position: Als Senior abas ERP-Entwickler bist du verantwortlich für die Weiterentwicklung, Anpassung und Betreuung unseres abas ERP-Systems. Ziel ist die effiziente Unterstützung und Optimierung d…
Skills: Abas ERP, Abas-FO programming, Java, Software development, Business process optimization
Berlin, Germany · On-site
Deine Aufgaben Du entwickelst und konstruierst gemeinsam mit dem Team innovative technische Lösungen und wirkst aktiv an der erfolgreichen Umsetzung von Entwicklungs- und Kundenprojekten mit.Als zentrale Ansprechperson k…
Skills: Mechanical engineering, Mechatronics, Special purpose machinery design, CAD software, SolidWorks
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You will be responsible for the further development, customization, and maintenance of the abas ERP system to optimize business processes. Additionally, you will develop new functionalities and support the 2nd-level team in error analysis and resolution.
Candidates must have a degree or vocational training in computer science or business informatics with relevant professional experience. Proficiency in Abas-FO and Java programming is required, along with strong analytical and communication skills.
Finetech ist ein weltweit tätiges mittelständisches Unternehmen im Sondermaschinenbau. Kerngeschäft sind Entwicklung, Herstellung und Vertrieb von Maschinen für die hochgenaue Mikromontage und die professionelle SMD‐Baugruppenreparatur.
Bei der Entwicklung unserer Produkte arbeiten wir eng mit Kunden aus unterschiedlichen Branchen wie z. B. Luftfahrt, Medizin‐ und Biotechnik, Unterhaltungselektronik, Halbleiterindustrie, Optoelektronik sowie Universitäten und Forschungseinrichtungen zusammen.
Am Stammsitz Berlin und damit Deinem künftigen Einsatzort sind mehr als 180 Mitarbeiter (m/w/d) beschäftigt. Weitere Niederlassungen befinden sich in Mesa (USA), Amherst (USA), Shanghai (CN), Ipoh (MY) und Tokio (JP).
We provide equipment solutions for the semiconductor industry - from R&D to automated production.
Headquartered in Berlin, Germany, Finetech is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for more than 30 years. We enable customers from early feasibility and process development through scalable, automated production. Our platforms share a consistent technology foundation, allowing seamless transfer from prototype to high-yield manufacturing without changing system logic or process philosophy. Finetech systems integrate a broad range of bonding technologies, including adhesive, eutectic, thermocompression, ultrasonic, indium bump interconnect, hybrid bonding, and direct bonding. This flexibility supports heterogeneous integration and complex microsystem assembly across applications such as optical transceivers, LiDAR modules, power devices, MEMS, RF components, quantum hardware, and high-density packages. Our cross-platform Prototype-to-Production approach helps customers establish robust processes early and transition them efficiently into controlled production environments with predictable performance and long-term stability. In addition, Finetech provides dedicated SMD rework solutions for electronics manufacturing and failure analysis. With subsidiaries on three continents and a global partner network, we deliver local expertise, fast support, and long-term technical collaboration worldwide.
Offices: Boxberger Straße 14, Berlin, 12681, DE · 325 E Elliot Rd, Suite 34, Chandler, Arizona 85225, US · 60 NH-101A, Building A, Amherst, New Hampshire 03031, US · 555 Lansong Rd, A103 Sunland Meilun, Pudong New Area, Shanghai, 200137, CN · 1687/1 Phahon Yothin Road, Chatuchak, Bangkok City 10900, TH
We provide equipment solutions for the semiconductor industry - from R&D to automated production.
Headquartered in Berlin, Germany, Finetech is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for more than 30 years. We enable customers from early feasibility and process development through scalable, automated production. Our platforms share a consistent technology foundation, allowing seamless transfer from prototype to high-yield manufacturing without changing system logic or process philosophy. Finetech systems integrate a broad range of bonding technologies, including adhesive, eutectic, thermocompression, ultrasonic, indium bump interconnect, hybrid bonding, and direct bonding. This flexibility supports heterogeneous integration and complex microsystem assembly across applications such as optical transceivers, LiDAR modules, power devices, MEMS, RF components, quantum hardware, and high-density packages. Our cross-platform Prototype-to-Production approach helps customers establish robust processes early and transition them efficiently into controlled production environments with predictable performance and long-term stability. In addition, Finetech provides dedicated SMD rework solutions for electronics manufacturing and failure analysis. With subsidiaries on three continents and a global partner network, we deliver local expertise, fast support, and long-term technical collaboration worldwide.
Offices: Boxberger Straße 14, Berlin, 12681, DE · 325 E Elliot Rd, Suite 34, Chandler, Arizona 85225, US · 60 NH-101A, Building A, Amherst, New Hampshire 03031, US · 555 Lansong Rd, A103 Sunland Meilun, Pudong New Area, Shanghai, 200137, CN · 1687/1 Phahon Yothin Road, Chatuchak, Bangkok City 10900, TH
