Berlin, Germany · On-site
Deine Aufgaben Montieren und Bearbeiten mechanischer Teile und Baugruppen für hochgenaue PlatziergeräteMontieren hochpräziser Platzierwerkzeuge für die MikromontageAusführen von Feinblech-, Dreh- und SchleifarbeitenAbnah…
Skills: Precision Mechanics, Assembly of Mechanical Components, Conventional Turning, Grinding, Sheet Metal Work
Berlin, Germany · On-site
Deine Aufgaben Herstellung und Inbetriebnahme elektronischer Geräte und Systeme Montage und Verdrahtung von Baugruppen und Komponenten Durchführung von Messungen, Prüfungen und Funktionskontrollen Fehlersuche, Diagnose u…
Skills: Electronic Assembly, System Adjustment, Circuit Diagram Interpretation, Troubleshooting, Quality Assurance
Berlin, Germany · On-site
Deine Aufgaben Du montierst und justierst komplexe elektronische, mechanische und optische Baugruppen oder Systeme eigenständig, mittels unterschiedlicher Techniken, nach Arbeitsplänen und ZeichnungenDu prüfst und analys…
Skills: Mechatronics Assembly, Electronics Assembly, Optical Component Assembly, Technical Documentation, Error Analysis
Sign up with Clera and we'll reach out the moment a role actually fits you — no more spraying applications into the void.
Assemble and process high-precision mechanical parts and tools for micro-assembly placement devices. Perform testing and documentation of assemblies according to test plans using specialized equipment.
Requires completed training as a precision mechanic, toolmaker, or equivalent professional experience. Must possess strong technical understanding, experience in conventional turning, and proficiency with ERP and MS Office software.
Finetech ist ein weltweit tätiges mittelständisches Unternehmen im Sondermaschinenbau. Kerngeschäft sind Entwicklung, Herstellung und Vertrieb von Maschinen für die hochgenaue Mikromontage und die professionelle SMD‐Baugruppenreparatur.
Bei der Entwicklung unserer Produkte arbeiten wir eng mit Kunden aus unterschiedlichen Branchen wie z. B. Luftfahrt, Medizin‐ und Biotechnik, Unterhaltungselektronik, Halbleiterindustrie, Optoelektronik sowie Universitäten und Forschungseinrichtungen zusammen.
Am Stammsitz Berlin und damit Deinem künftigen Einsatzort sind mehr als 180 Mitarbeiter (m/w/d) beschäftigt. Weitere Niederlassungen befinden sich in Mesa (USA), Amherst (USA), Shanghai (CN), Ipoh (MY) und Tokio (JP).
We provide equipment solutions for the semiconductor industry - from R&D to automated production.
Headquartered in Berlin, Germany, Finetech is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for more than 30 years. We enable customers from early feasibility and process development through scalable, automated production. Our platforms share a consistent technology foundation, allowing seamless transfer from prototype to high-yield manufacturing without changing system logic or process philosophy. Finetech systems integrate a broad range of bonding technologies, including adhesive, eutectic, thermocompression, ultrasonic, indium bump interconnect, hybrid bonding, and direct bonding. This flexibility supports heterogeneous integration and complex microsystem assembly across applications such as optical transceivers, LiDAR modules, power devices, MEMS, RF components, quantum hardware, and high-density packages. Our cross-platform Prototype-to-Production approach helps customers establish robust processes early and transition them efficiently into controlled production environments with predictable performance and long-term stability. In addition, Finetech provides dedicated SMD rework solutions for electronics manufacturing and failure analysis. With subsidiaries on three continents and a global partner network, we deliver local expertise, fast support, and long-term technical collaboration worldwide.
Offices: Boxberger Straße 14, Berlin, 12681, DE · 325 E Elliot Rd, Suite 34, Chandler, Arizona 85225, US · 60 NH-101A, Building A, Amherst, New Hampshire 03031, US · 555 Lansong Rd, A103 Sunland Meilun, Pudong New Area, Shanghai, 200137, CN · 1687/1 Phahon Yothin Road, Chatuchak, Bangkok City 10900, TH
We provide equipment solutions for the semiconductor industry - from R&D to automated production.
Headquartered in Berlin, Germany, Finetech is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for more than 30 years. We enable customers from early feasibility and process development through scalable, automated production. Our platforms share a consistent technology foundation, allowing seamless transfer from prototype to high-yield manufacturing without changing system logic or process philosophy. Finetech systems integrate a broad range of bonding technologies, including adhesive, eutectic, thermocompression, ultrasonic, indium bump interconnect, hybrid bonding, and direct bonding. This flexibility supports heterogeneous integration and complex microsystem assembly across applications such as optical transceivers, LiDAR modules, power devices, MEMS, RF components, quantum hardware, and high-density packages. Our cross-platform Prototype-to-Production approach helps customers establish robust processes early and transition them efficiently into controlled production environments with predictable performance and long-term stability. In addition, Finetech provides dedicated SMD rework solutions for electronics manufacturing and failure analysis. With subsidiaries on three continents and a global partner network, we deliver local expertise, fast support, and long-term technical collaboration worldwide.
Offices: Boxberger Straße 14, Berlin, 12681, DE · 325 E Elliot Rd, Suite 34, Chandler, Arizona 85225, US · 60 NH-101A, Building A, Amherst, New Hampshire 03031, US · 555 Lansong Rd, A103 Sunland Meilun, Pudong New Area, Shanghai, 200137, CN · 1687/1 Phahon Yothin Road, Chatuchak, Bangkok City 10900, TH
