Shanghai, Shanghai, China · On-site
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Skills: ASIC Design, RTL Analysis, Synthesis, Static Timing Analysis, Physical Design
Shanghai, Shanghai, China · On-site
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Skills: ASIC Design, RTL Analysis, Synthesis, Static Timing Analysis, Physical Design
Irvine, California, United States · On-site
$144k–$230k/yr
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Skills: Physical Design, Static Timing Analysis (STA), Design For Test (DFT), Packaging, PPA Tradeoffs
San Jose, California, United States · On-site
$101k–$162k/yr
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Skills: IBM Assembler, z/OS, Agile, Endevor, GitHub
Plano, Texas, United States · On-site
$91k–$146k/yr
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Skills: Agile Methodologies, Scrum, Kanban, Lean Principles, Coaching
Irvine, California, United States · On-site
$144k–$230k/yr
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Skills: Physical Design, Static Timing Analysis (STA), Design For Test (DFT), Packaging, PPA Tradeoffs
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: System Verilog, UVM, ASIC Design Verification, RTL Verification, OVM
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: ASIC Design, SystemVerilog, Verilog, RTL Design, Static Timing Analysis
Irvine, California, United States · On-site
$144k–$230k/yr
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Skills: Physical Design, Static Timing Analysis (STA), Design For Test (DFT), Packaging, PPA Tradeoffs
San Jose, California, United States · On-site
$122k–$195k/yr
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Skills: Physical IC Design, Synthesis, Physical Verification, Timing Closure, EM/IR Analysis
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: Physical IC Design, Synthesis, Physical Verification, Timing Closure, EM/IR Analysis
San Jose, California, United States · On-site
$144k–$230k/yr
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Skills: System Verilog, UVM, ASIC Design Verification, RTL Verification, OVM
Batu Kawan, Penang, Malaysia · On-site
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Skills: Inventory Management, RF Scanner, Picking and Packing, Stock Counting, Warehouse Operations
Durham, North Carolina, United States · On-site
$104k–$167k/yr
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Skills: Agile Product Ownership, Backlog Grooming, Stakeholder Management, User Story Creation, Strategic Execution
Shanghai, Shanghai, China · On-site
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Skills: Physical Design, Floor Planning, Placement, Design Closure, STA
Shanghai, Shanghai, China · On-site
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Skills: Physical Design, Floor Planning, Placement, Design Closure, STA
Shanghai, Shanghai, China · On-site
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Skills: Physical Design, Floor Planning, Placement, Design Closure, STA
Shanghai, Shanghai, China · On-site
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Skills: ASIC Physical Design, Full Chip Synthesis, Static Timing Analysis, Floorplanning, Placement
Shanghai, Shanghai, China · On-site
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Skills: Physical Design, Floor Planning, Placement, Design Closure, STA
Shanghai, Shanghai, China · On-site
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Skills: IC Design, ASIC Design Flow, RTL Analysis, Synthesis, Static Timing Analysis
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Develop state-of-the-art IC solutions using CMOS cell-based ASIC technologies through all development phases. Responsibilities include full chip synthesis, STA, and physical design implementation for 5nm/3nm designs.
Candidates need a solid VLSI background and experience with ASIC design flows and tapeouts in 5nm or smaller processes. A Master's degree in Microelectronics or a related discipline is preferred.
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Broadcom Limited offers an excellent opportunity to contribute to a team environment and to grow personal career path. You will be working with internal and external customers to develop state of the art IC solutions utilizing Broadcom’s leading-edge CMOS cell-based ASIC technologies. You will have responsibility for ASIC designs through all of the key development and implementation phases including RTL analysis, synthesis, design optimization, timing verification, simulation, test insertion, physical design, vector generation, and post-prototype test support. Candidates will have opportunity to work on the latest 5nm/3nm designs
Detail design tasks include
Full Chip Synthesis and STA: An ideal candidate should have some background on full chip synthesis flow (DC, DCT, DCG) for 5nm/3nm design tape out. It would be better if the candidate have the experience running full chip STA and constraint clean up flow.
Physical Design Implementation: An ideal candidate having some background in either the Physical Design which includes floor planning, placement, design closure, and DRC & LVS skills.
Overall, candidates are expected to develop the most of above skills. Candidates who have the desire to seek the in-depth and broad technical challenge should apply.
Requirements/Qualifications
- Candidates should have good understanding about ASIC design flow and solid VLSI background.
- Candidates should be able to handle block implementation/top level task independently.
- Tapeout experience in 5nm and blow process design.
- Candidate s should have strong communications and problem solving skills.
- Candidates with experience in any one of following knowledge are a plus
- DFT insertion
- Power/IVD analysis
- DRC/LVS
- Top Floorplan/STA & Low Power
- Candidate is good at Perl/Tcl/Python
Education/Certifications
Preferred Degree: MS Preferred Major: Microelectronics or related discipline
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Offices: 3401 Hillview Ave, Palo Alto, California 94304, US
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Offices: 3401 Hillview Ave, Palo Alto, California 94304, US
