Cambridge, England, United Kingdom · Hybrid
$74k–$121k/yr
Overview At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, s…
Skills: Co-packaged Optics, Advanced Packaging, 2.5D/3D Integration, Optical Coupling, Fiber Attach
Cambridge, England, United Kingdom · On-site
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Skills: Application Security, Product Security, Web Application Security Testing, API Security, Threat Modeling
Cambridge, England, United Kingdom · On-site
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Skills: Application Security, Product Security, Web Application Security Testing, API Security, Threat Modeling
Cambridge, England, United Kingdom · On-site
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Cambridge, England, United Kingdom · Hybrid
$30k–$35k/yr
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Cambridge, England, United Kingdom · On-site
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Cambridge, England, United Kingdom · Hybrid
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Cambridge, England, United Kingdom · Hybrid
Mace combines construction expertise with consultancy to unlock potential in every person or project and redefine the boundaries of ambition. Our values shape the way we consult and define the people we want to join us o…
Skills: Project Controls, PMO Management, Cost Management, Schedule Management, Risk Management
Cambridge, England, United Kingdom · Hybrid
Mace combines construction expertise with consultancy to unlock potential in every person or project and redefine the boundaries of ambition. Our values shape the way we consult and define the people we want to join us o…
Skills: Project Controls, PMO Management, Cost Management, Schedule Management, Change Management
Cambridge, England, United Kingdom · On-site
About Huawei Research and Development UK Limited Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have 207,000 employees and ope…
Skills: GPU Software Architecture, Vulkan, DirectX, OpenGL ES, Metal
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Design and develop packaging architectures for co-packaged optics, integrating photonic devices, ASICs, and interposers. Collaborate with multidisciplinary teams and Tier-1 suppliers to translate research prototypes into manufacturable AI infrastructure solutions.
Requires a Master's or PhD in Electrical Engineering, Photonics, Materials Science, or a related field. Must have proven industry experience in advanced optical packaging and CPO technologies, including hands-on experience with fiber attach and high-speed interconnects.
At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design.
We are seeking an Optical Packaging Engineer with deep expertise in co-packaged optics and advanced packaging technologies. The successful candidate will play a critical role in bridging photonic devices, electronic ICs, and system-level integration through scalable, manufacturable packaging solutions. You will work closely with both Microsoft R&D teams and Azure engineering teams to bring innovations from prototype to production.
This role offers a unique opportunity to work hands-on with cutting-edge technologies while collaborating with world-class researchers, internal product teams, and Tier-1 partners to translate research into deployable systems.
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
Microsoft is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
CPO Architecture & Packaging Co-Design
Advanced Packaging Development
Optical Assembly & Alignment Strategy
Cross-Disciplinary Co-Design
Partner Engagement & Technology Transfer
Prototyping, Validation & Iteration
Required/Minimum Qualifications
Master’s or PhD’s degree in Electrical Engineering, Photonics, Materials Science, or a related field.
Proven industry experience in wafer/panel level and advanced packaging with a strong focus on optical packaging, Co-packaged optics (CPO) or closely related technologies.
Hands-on experience with:
Optical module or CPO packaging design
Fiber attach / optical coupling techniques
High-speed interconnect packaging and signal integrity considerations
Strong understanding of system-level trade-offs (electrical, optical, thermal, mechanical).
Ability to operate effectively in a multi-disciplinary environment.
Excellent communication skills in English, both written and spoken, including the skill to clearly communicate technical results and justify assumptions to diverse technical audiences.
Additional or Preferred Qualifications
Experience in advanced semiconductor packaging (e.g., FCBGA, 2.5D/3D integration).
Familiarity with hyperscale data center interconnect requirements.
Experience working with external manufacturing partners or Tier-1 suppliers.
Track record of delivering packaging solutions from concept to prototype or production.
Background aligned with leading CPO practitioners (e.g., industry or research experience similar to co-packaged optics leaders).
Research Sciences IC4 - The typical base pay range for this role across United Kingdom is £ 74,700.00 - £ 112,100.00 per year. Certain roles may be eligible for benefits and other compensation.
Find additional benefits and pay information here:
https://careers.microsoft.com/v2/global/en/corporate-pay/united-kingdom-corporate-pay.html
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.
Every company has a mission. What's ours? To empower every person and every organization to achieve more. We believe technology can and should be a force for good and that meaningful innovation contributes to a brighter world in the future and today. Our culture doesn’t just encourage curiosity; it embraces it. Each day we make progress together by showing up as our authentic selves. We show up with a learn-it-all mentality. We show up cheering on others, knowing their success doesn't diminish our own. We show up every day open to learning our own biases, changing our behavior, and inviting in differences. Because impact matters. Microsoft operates in 190 countries and is made up of approximately 228,000 passionate employees worldwide.
Offices: 1 Microsoft Way, Redmond, Washington 98052, US · 1 Denison Street, North Sydney, NSW 2060, AU · 1950 Meadowvale Blvd, Mississauga, Ontario L5N 8L9, CA · 39, Quai du Président Roosevelt, Issy-les-Moulineaux, Île-de-France 92130, FR · Walter-Gropius-Straße 5, München, 80807, DE
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