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Diamond Foundry

Technical Program Manager

Location
Bay Area, California
Workplace
On-site
Compensation
$170k – $230k
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About this role

Diamond Foundry is seeking an experienced Technical Program Manager to lead strategic customer-facing technology development programs for our advanced single-crystal solutions. This role serves as the bridge between engineering, customers, and business teams, driving complex technical programs from concept through product introduction. 

 

The ideal candidate has a strong technical foundation in semiconductor materials and packaging, outstanding communication skills, and a proven ability to drive execution. They are a proactive leader who can build customer relationships, align cross-functional teams, and deliver results in a fast-paced environment. 

\nResponsibilities:

  • Lead customer-facing technical development programs from kickoff through successful execution.

  • Serve as the primary interface between customers and internal engineering teams, communicating technical concepts clearly and managing expectations.

  • Drive cross-functional program execution by coordinating engineering, product, manufacturing, and business teams to achieve technical, business, and schedule objectives.

  • Lead technical reviews, customer meetings, and executive program updates while proactively identifying risks and driving timely resolution of issues.

  • Support New Product Introduction (NPI) activities, including project planning, design reviews, customer deliverables, and schedule management.
  • Represent Diamond Foundry's single-crystal diamond technology and advanced packaging capabilities to customers and strategic partners.
Qualifications

  • Advanced degree in Materials Science, Materials Engineering, Chemical Engineering, or a related engineering discipline; MBA is a plus.

  • 5+ years of experience in semiconductor manufacturing, wafer fabrication, advanced packaging, or related technologies.

  • Strong understanding of semiconductor materials, wafer fabrication, device packaging, and bonding technologies.

  • Proven customer-facing experience with the ability to communicate complex technical concepts clearly and professionally.

  • Exceptional communication, organizational, and program management skills with a demonstrated ability to drive results and meet aggressive deadlines.
  • Experience working with semiconductor packaging suppliers and the broader semiconductor ecosystem is highly desirable.
\n
$170,000 - $230,000 a year
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