Beaverton, Oregon, United States · On-site
$19/hr–$20/hr
Job Description - Production Operator SEMPAC is seeking dependable Production Operators to join our growing manufacturing team. This position supports a dynamic production environment with evolving processes and provides…
Skills: Kitting, Part Cleaning, Media Blasting, Punch Press Operation, Transfer Molding Press Operation
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The Production Operator is responsible for kitting materials, operating various manufacturing machinery, and performing detailed assembly and inspection tasks. They contribute to the quality and efficiency of semiconductor packaging solutions through precision work and continuous improvement activities.
Candidates must have a High School Diploma or GED and prior experience using tweezers and small tools under a microscope. Ability to communicate in English, perform basic math, and pass a background check and drug screening is required.
Job Description - Production Operator
SEMPAC is seeking dependable Production Operators to join our growing manufacturing team. This position supports a dynamic production environment with evolving processes and provides the opportunity to contribute directly to the quality, efficiency, and continuous improvement of our operations. Successful candidates are reliable, detail‑oriented, and perform well in small, team‑based, task‑focused settings.
Our employees play at critical role at SEMPAC. Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to specifications at every stage of production enable us to consistently meet customer requirements for quality, performance, and delivery.
SEMPAC is a privately owned company located in Oregon’s Silicon Forest, focused on the design, development, and manufacture of pre‑molded, open‑cavity semiconductor packages. Our products enable integrated circuits and micromachined devices to interface reliably with the external environment. We provide customized packaging solutions for a wide range of applications, including avionics, aerospace, high‑frequency RF, broadband communications, optoelectronics, MEMS, sensors, and military systems.
SEMPAC is committed to equal employment opportunity and does not discriminate based on age, color, national origin, citizenship status, physical or mental disability, race, religion, creed, sex, sexual orientation, gender identity or expression, genetic information, marital status, political affiliation, veteran status, or any other legally protected characteristic. Reasonable accommodations are provided to qualified individuals with disabilities.
This position offers an opportunity to contribute to a growing manufacturing organization committed to safety, quality, precision, and continuous improvement.
Essential Functions
Kitting materials
Part cleaning
Media blasting of components
Operating punch press
Operating transfer molding press
Operating sawing equipment
Performing detailed, hands‑on assembly and inspection tasks requiring precision and sustained focus.
Participation in continuous improvement activities
Qualifications
Prior experience using tweezers and small tools under microscope is required.
Prior electronics experience preferred.
Prior lean manufacturing experience preferred.
Must be able to communicate both verbally and in written form in English.
Must demonstrate the ability to read inspection, assembly, and rework instructions.
Must demonstrate basic math skills
Required Education and Experience
High School Diploma, GED or equivalent
Must pass a background check
Drug screening is required
Working Environment
This position is performed in a manufacturing environment where ambient temperatures are frequently elevated
Physical Demands
Standing or remaining stationary for extended periods
Performing repetitive hand and finger motions using small tools
Conducting visual inspections of small components
Occasional lifting of materials weighing up to 35 pounds, with infrequent lifting of materials weighing up to 60 pounds.
Innovative Solutions in Semiconductor Packaging
SEMPAC, a privately-owned company in the Pacific Northwest / Silicon Forest devoted to the design, development and manufacture of Pre-molded “Open-Cavity” Plastic Packages. SEMPAC exclusively focuses on the development of integrated packaging solutions. All of the materials used in our manufacturing processes are RoHS and REACH compliant. Our Open-Pak™ packages are molded with green molding compounds, plated with Au/Ni for superior bondability and meet JEDEC outlines. Our core belief is that by forming lasting partnerships with our customers, both parties’ benefit. By remaining independent and not competing with our partners we are better able to work together to bring innovative packaging solutions to the market. Our engineers and management team are package, assembly, and material veterans. We are fully aware of the demands made in today’s assembly environment.
Offices: 9640 SW Sunshine Ct, Suite 800, Beaverton, Oregon 97005, US
Innovative Solutions in Semiconductor Packaging
SEMPAC, a privately-owned company in the Pacific Northwest / Silicon Forest devoted to the design, development and manufacture of Pre-molded “Open-Cavity” Plastic Packages. SEMPAC exclusively focuses on the development of integrated packaging solutions. All of the materials used in our manufacturing processes are RoHS and REACH compliant. Our Open-Pak™ packages are molded with green molding compounds, plated with Au/Ni for superior bondability and meet JEDEC outlines. Our core belief is that by forming lasting partnerships with our customers, both parties’ benefit. By remaining independent and not competing with our partners we are better able to work together to bring innovative packaging solutions to the market. Our engineers and management team are package, assembly, and material veterans. We are fully aware of the demands made in today’s assembly environment.
Offices: 9640 SW Sunshine Ct, Suite 800, Beaverton, Oregon 97005, US
