Omni Design Technologies is seeking an experienced Technical Program Manager to lead the planning and execution of complex semiconductor IP and SoC development programs. The ideal candidate combines strong technical expe…
Skills: Technical Program Management, IC Design, Semiconductor Development Lifecycle, Risk Management, Stakeholder Management
Principal / Lead DSP & Systems Architect — Ultra High-Speed SerDes
Milpitas, California, United States · On-site
Senior+$35M raised
About the Company Omni Design Technologies provides high-performance, ultra-low power IP solutions across advanced CMOS nodes, enabling differentiated SoC architectures for AI/ML accelerators, hyperscale datacenter inter…
Skills: DSP Architecture, SerDes, Link Modeling, MATLAB, Python
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Full-time
bachelor degree, postgraduate degree
Posted 33d ago
~40 hrs/week
Responsibilities
Lead cross-functional semiconductor development programs from architecture through silicon release, ensuring timely execution by tracking milestones and risks. Coordinate design reviews across various engineering teams and drive regular program updates with executive leadership.
Requirements
Requires a BS/MS in Electrical or Computer Engineering with over 8 years of semiconductor experience, including at least one successful silicon tapeout. Must have 3+ years of technical program management experience and a deep understanding of the full ASIC/SoC development lifecycle.
Full job description
Omni Design Technologies is seeking an experienced Technical Program Manager to lead the planning and execution of complex semiconductor IP and SoC development programs. The ideal candidate combines strong technical expertise with exceptional program management skills and has a solid foundation in semiconductor design.
Candidates should have prior hands-on IC design experience and must have participated in at least one successful silicon tapeout before moving into or expanding into a program management role. This technical background enables effective communication with engineering teams, informed decision-making, and proactive management of technical and schedule risks throughout the product development lifecycle.
In this role, you will work closely with Analog, Digital, Layout, and other cross-functional technical teams, as well as executive leadership, to ensure successful execution of multiple development programs from concept through silicon release.
\nResponsibilities and Qualifications
Lead cross-functional semiconductor development programs from architecture and planning through silicon release.
Schedule, coordinate, and track resources, milestones, dependencies, and risks to ensure timely execution of projects.
Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.
Drive regular program reviews with engineering leadership and executive management, including clear status and decision tracking.
Identify technical and schedule risks early and work with stakeholders to define practical mitigation plans.
Partner with engineering managers to balance priorities, staffing requirements, and program deliverables.
Develop and maintain productive working relationships with partners, engineering teams, and leadership stakeholders distributed across global sites and time zones.
Interface with customers, vendors, and internal stakeholders for specific programs and project commitments as needed.
Improve project execution processes, planning methods, communication practices, and program tracking metrics.
Support adoption and disciplined use of project management tools such as Jira, Structure, Microsoft Project, Smartsheet, or similar systems.
BS/MS in Electrical Engineering, Computer Engineering, or a related technical discipline.
8+ years of semiconductor industry experience.
Minimum 2 years of hands-on IC design experience (Analog, Mixed-Signal, Digital, Verification, Physical Design, Layout, or Systems Engineering), including at least one complete ASIC, SoC, or IP development cycle through silicon tapeout in a technical engineering role.
3+ years of Technical Program Management, Engineering Program Management, or closely related project leadership experience for semiconductor development programs.
Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.
Strong technical problem-solving skills, including risk assessment, root cause analysis, and decision support in a fast-paced engineering environment.
Excellent communication, organization, stakeholder management, influencing, and negotiation skills.
Experience managing Analog/Mixed-Signal IP, high-speed data converter, or SoC development programs
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Related keywords
SemiconductorIPSoCASICSilicon TapeoutRTLSynthesisTiming ClosureLayout IntegrationSilicon ValidationAnalog Mixed-SignalHigh-speed Data ConverterJiraStructureMicrosoft ProjectSmartsheet
The Industry Leader for Ultra Power Efficient High Performance Data Converters
Industry
Semiconductor Manufacturing
Company size
11-50 employees
Founded
2015
Headquarters
Milpitas, California
LinkedIn followers
11,327
Total funding
$35M
Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores in advanced FinFET nodes to 28nm, that enable differentiated systems-on-chip (SoCs) in applications ranging from 5G, wireline and optical communications, LiDAR, radar, networking, AI, image sensors, and IoT. Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few Msps to over 20 Gsps sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins, Colorado, Boston, Massachusetts and Bangalore, India.
Offices: 1525 McCarthy Blvd, Milpitas, California 95035, US · 44 Manning Rd, Billerica, Massachusetts 01821, US · No.293/154/172, Outer Ring Rd., Kadubeesanahalli, Bengaluru, IN · 1027 West Horsetooth Rd., #F204, Fort Collins, CO 80526, US
Analog and Mixed SignalAnalog to Digital ConvertersUltra Low Power5GLiDARRadarAutomotiveAINetworkingand Digital to Analog Converters
The Industry Leader for Ultra Power Efficient High Performance Data Converters
Industry
Semiconductor Manufacturing
Company size
11-50 employees
Founded
2015
Headquarters
Milpitas, California
LinkedIn followers
11,327
Total funding
$35M
Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores in advanced FinFET nodes to 28nm, that enable differentiated systems-on-chip (SoCs) in applications ranging from 5G, wireline and optical communications, LiDAR, radar, networking, AI, image sensors, and IoT. Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few Msps to over 20 Gsps sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins, Colorado, Boston, Massachusetts and Bangalore, India.
Offices: 1525 McCarthy Blvd, Milpitas, California 95035, US · 44 Manning Rd, Billerica, Massachusetts 01821, US · No.293/154/172, Outer Ring Rd., Kadubeesanahalli, Bengaluru, IN · 1027 West Horsetooth Rd., #F204, Fort Collins, CO 80526, US
Analog and Mixed SignalAnalog to Digital ConvertersUltra Low Power5GLiDARRadarAutomotiveAINetworkingand Digital to Analog Converters