Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
We are seeking a Project Manager to lead and drive large-scale technical projects, ensuring project plans, requirements, governance, and stakeholder alignment are effectively managed from initiation to delivery. This rol…
Skills: Project Planning, Stakeholder Management, Governance, Cross-functional Collaboration, Vendor Management
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Lead and drive large-scale technical projects from initiation to delivery, ensuring alignment of requirements and governance. The role involves managing project plans, collaborating with stakeholders, and mentoring team members in project management practices.
Requires at least 5 years of experience in engineering equipment development and a preferred bachelor's degree in an engineering discipline. Candidates should possess strong leadership skills and fluency in English, Chinese, and Mandarin.
We are seeking a Project Manager to lead and drive large-scale technical projects, ensuring project plans, requirements, governance, and stakeholder alignment are effectively managed from initiation to delivery. This role will strengthen project management practices, cross-functional collaboration, and execution excellence to support successful project outcomes.
Key Responsibilities
Create and maintain project plans and schedules, ensuring project requirements are clearly defined and aligned with project objectives
Collaborate with employees, management, clients, and internal/external stakeholders across engineering, manufacturing, and operations
Implement portfolio and project management practices, particularly for NPI and manufacturing-related projects
Develop and deliver clear communications, training materials, and post-delivery support plans
Directs large scale, technical projects, and collaborates with employees, leadership, clients, and other internal and external stakeholders
Mentors team members in project management, processes, tools, and techniques
Manages clear and specific contractual terms for required project work with vendors
Ensures projects have the appropriate governance and management controls and practices
Education
Bachelor’s degree in Engineering discipline is preferred
Experience
At least 5+ years of experience in engineering equipment development, preferably in NPI, capital equipment manufacturing, or semiconductor industries
Project Management certification (e.g. PMP) is preferred
Key Competencies & Behaviours
Detail-minded with strong numeric and business acumen
Expert planning and tracking skills, capable of managing multiple projects, well organized, excellent time management with respect to priorities and self-management
Ability to create structure in ambiguous situations and design effective processes
Strong management and leadership skills, with the ability to lead cross-functional teams effectively in a dynamic environment
Creative problem-solving skills for maintaining project timelines and developing alternative scenarios
Fluent in spoken and written English, Chinese and Mandarin
Attractive salary and fringe benefits package will be offered to the right candidates.
Please visit our company website for our company background, products and other useful information.
Website: https://www.asmpt.com/
Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.
Enabling the Digital World
ASMPT is the leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing. We are the only company in the world offering a comprehensive portfolio of integrated solutions for all major steps in electronics manufacturing. From bridging the gap between chip assembly and packaging to SMT, we help the world’s top manufacturers build the technology that powers everyday life. This is what we mean by enabling the digital world. Any device containing electronics has probably been developed or built using ASMPT's solutions. We are enabling the digital world. What We Do Our integrated solutions span the full electronics manufacturing value chain: • Semiconductor assembly and advanced packaging, including thermo-compression bonding, hybrid bonding, and multi-chip bonding • Surface mount technology (SMT) for high-precision electronics production and the Intelligent Factory • Manufacturing execution systems (MES) for smart factory operations From wafer-level processing to final chip assembly, our solutions and software are behind the critical components used in AI, automotive, high-performance computing (HPC), and 5G communications. Who We Work With We partner with leading IDMs, OSATs, and electronics manufacturers worldwide to deliver reliable, high-precision solutions that keep them at the forefront of innovation. Our Global Presence Founded in 1975 and headquartered in Singapore, ASMPT directly operates in over 30 countries and is represented with Sales and Service Locations in 52 countries, plus 15+ manufacturing and R&D centres across Asia, Europe, and the Americas. More than 10,600 employees drive our mission forward every day. We are listed on the Hong Kong Stock Exchange (HKEX: 0522). Our Commitment Innovation, People, and Sustainability sit at the core of everything we do. We are shaping a bright and sustainable future that creates lasting value for our customers, employees, investors, and society.
Offices: 2 Yishun Avenue 7, Singapore, Singapore 768924, SG · 18/F, Gateway ts, 8 Cheung Fai Road, Tsing Yi, New Territories, Tsing Yi , Hong Kong -, HK · PLO 534, Jalan Keluli 3, Kawasan Perindustrian Pasir Gudang, Pasir Gudang, Johor, Malaysia 81700, MY · Rupert-Mayer Straße 48, Munich, Bavaria 81379, DE · Bermann Miksa utca, Gyor, Győr-Moson-Sopron 9027, HU
Enabling the Digital World
ASMPT is the leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing. We are the only company in the world offering a comprehensive portfolio of integrated solutions for all major steps in electronics manufacturing. From bridging the gap between chip assembly and packaging to SMT, we help the world’s top manufacturers build the technology that powers everyday life. This is what we mean by enabling the digital world. Any device containing electronics has probably been developed or built using ASMPT's solutions. We are enabling the digital world. What We Do Our integrated solutions span the full electronics manufacturing value chain: • Semiconductor assembly and advanced packaging, including thermo-compression bonding, hybrid bonding, and multi-chip bonding • Surface mount technology (SMT) for high-precision electronics production and the Intelligent Factory • Manufacturing execution systems (MES) for smart factory operations From wafer-level processing to final chip assembly, our solutions and software are behind the critical components used in AI, automotive, high-performance computing (HPC), and 5G communications. Who We Work With We partner with leading IDMs, OSATs, and electronics manufacturers worldwide to deliver reliable, high-precision solutions that keep them at the forefront of innovation. Our Global Presence Founded in 1975 and headquartered in Singapore, ASMPT directly operates in over 30 countries and is represented with Sales and Service Locations in 52 countries, plus 15+ manufacturing and R&D centres across Asia, Europe, and the Americas. More than 10,600 employees drive our mission forward every day. We are listed on the Hong Kong Stock Exchange (HKEX: 0522). Our Commitment Innovation, People, and Sustainability sit at the core of everything we do. We are shaping a bright and sustainable future that creates lasting value for our customers, employees, investors, and society.
Offices: 2 Yishun Avenue 7, Singapore, Singapore 768924, SG · 18/F, Gateway ts, 8 Cheung Fai Road, Tsing Yi, New Territories, Tsing Yi , Hong Kong -, HK · PLO 534, Jalan Keluli 3, Kawasan Perindustrian Pasir Gudang, Pasir Gudang, Johor, Malaysia 81700, MY · Rupert-Mayer Straße 48, Munich, Bavaria 81379, DE · Bermann Miksa utca, Gyor, Győr-Moson-Sopron 9027, HU
