Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
We are seeking an experienced R&D Manager to lead the development of advanced semiconductor packaging solutions, with a focus on ultrasonic actuator technology, precision motion systems, and innovative mechatronic produc…
Skills: Semiconductor packaging, Ultrasonic actuator technology, Precision motion systems, Mechatronic system design, Engineering simulation
Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
Develop Computer Vision products and solutions to enable semiconductor world On-job training will be provided to master computer vision technology Work as a team and cooperate with different R&D teams Implement computer …
Skills: Computer Vision, C, C++, Software Development, Algorithm Design
Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
Deliver technical presentations and product demonstrations to customers. Manage and coordinate system requirements and technical specifications with customers and internal teams. Develop and maintain a strong understandi…
Skills: Technical Presentations, Product Demonstrations, System Requirements Management, Technical Specifications, Sample Builds
Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
Design cooling and heating systems and follow through the deployment Drive thermal designs with numerical approaches, model based analysis Conduct experiments to validate designs Develop and optimize automation scripts f…
Skills: Thermal Design, Numerical Analysis, Computational Modeling, CFD, Precision Machine Design
Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
Design and support digital hardware platforms for semiconductor packaging machines. Design and develop digital circuits using FPGAs and microcontrollers. Develop digital interfaces for machine subsystems and system integ…
Skills: Digital Circuit Design, FPGA Development, Verilog, VHDL, C
Hong Kong, Hong Kong Island, Hong Kong S.A.R. · On-site
We are seeking a Project Manager to lead and drive large-scale technical projects, ensuring project plans, requirements, governance, and stakeholder alignment are effectively managed from initiation to delivery. This rol…
Skills: Project Planning, Stakeholder Management, Governance, Cross-functional Collaboration, Vendor Management
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The R&D Manager will lead the design and development of advanced semiconductor packaging equipment and mechatronic systems. They are responsible for managing engineering projects, driving technology innovation, and collaborating with global teams to ensure successful product commercialization.
Candidates must hold a Master's degree or higher in Mechanical Engineering, Mechatronics, or a related field. A minimum of 6 years of experience in R&D or product development within the semiconductor or precision engineering industry is required.
We are seeking an experienced R&D Manager to lead the development of advanced semiconductor packaging solutions, with a focus on ultrasonic actuator technology, precision motion systems, and innovative mechatronic products. The successful candidate will manage engineering projects and teams, drive technology innovation, and collaborate closely with global R&D, manufacturing, and product teams to deliver high-performance products from concept to commercialization.
Research & Development
Lead the research, design, and development of advanced technologies to be applied in semiconductor packaging equipment.
Develop, optimize, and design mechatronic precision system in Sub micron level
Familiar with motion control is preferred.
Conduct engineering simulations, performance analysis, and verification testing to achieve product performance and reliability objectives.
Project Management
Plan, manage, and monitor R&D projects to ensure timely delivery, budget control, and achievement of technical milestones.
Coordinate resources and priorities across multiple development projects.
Prepare project updates, technical reports, and development roadmaps for management review.
Product Industrialization & Manufacturing Support
Work closely with manufacturing teams to facilitate new product introduction (NPI) and technology transfer.
Drive yield improvement, process optimization, cost reduction, and quality enhancement initiatives.
Develop standardized production processes and engineering documentation to support mass production.
Cross-Functional Collaboration
Collaborate with global R&D teams, suppliers, and external partners on technology development projects.
Provide technical expertise and problem-solving support for production, quality, operations, and customer-facing teams.
Partner with product management to translate market requirements into technical solutions.
Innovation & Intellectual Property
Contribute to the development of proprietary technologies and intellectual property.
Support patent filing activities and technology innovation initiatives.
Monitor industry trends and emerging technologies within semiconductor packaging and precision engineering.
Education
Master's Degree or above in Mechanical Engineering, Mechatronics, Automation and Computer-Aided Engineering, or related disciplines.
Experience
Minimum 6 years of experience in R&D, product development, or engineering within semiconductor equipment, advanced packaging, precision engineering, or related industries.
Proven track record in product development projects.
Preferred experience in a multinational engineering environment.
Technical Competencies
Semiconductor electronics packaging processes and equipment
Precision motion control systems
Piezoelectric actuators and transducers
Mechatronic system design
Finite Element Analysis (FEA) and engineering simulation
Product validation and reliability testing
Design for Manufacturing (DFM) and Design for Assembly (DFA)
Root cause analysis and problem solving
New Product Introduction (NPI)
Attractive salary and fringe benefits package will be offered to the right candidates.
Please visit our company website for our company background, products and other useful information.
Website: https://www.asmpt.com/
Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.
Enabling the Digital World
ASMPT is the leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing. We are the only company in the world offering a comprehensive portfolio of integrated solutions for all major steps in electronics manufacturing. From bridging the gap between chip assembly and packaging to SMT, we help the world’s top manufacturers build the technology that powers everyday life. This is what we mean by enabling the digital world. Any device containing electronics has probably been developed or built using ASMPT's solutions. We are enabling the digital world. What We Do Our integrated solutions span the full electronics manufacturing value chain: • Semiconductor assembly and advanced packaging, including thermo-compression bonding, hybrid bonding, and multi-chip bonding • Surface mount technology (SMT) for high-precision electronics production and the Intelligent Factory • Manufacturing execution systems (MES) for smart factory operations From wafer-level processing to final chip assembly, our solutions and software are behind the critical components used in AI, automotive, high-performance computing (HPC), and 5G communications. Who We Work With We partner with leading IDMs, OSATs, and electronics manufacturers worldwide to deliver reliable, high-precision solutions that keep them at the forefront of innovation. Our Global Presence Founded in 1975 and headquartered in Singapore, ASMPT directly operates in over 30 countries and is represented with Sales and Service Locations in 52 countries, plus 15+ manufacturing and R&D centres across Asia, Europe, and the Americas. More than 10,600 employees drive our mission forward every day. We are listed on the Hong Kong Stock Exchange (HKEX: 0522). Our Commitment Innovation, People, and Sustainability sit at the core of everything we do. We are shaping a bright and sustainable future that creates lasting value for our customers, employees, investors, and society.
Offices: 2 Yishun Avenue 7, Singapore, Singapore 768924, SG · 18/F, Gateway ts, 8 Cheung Fai Road, Tsing Yi, New Territories, Tsing Yi , Hong Kong -, HK · PLO 534, Jalan Keluli 3, Kawasan Perindustrian Pasir Gudang, Pasir Gudang, Johor, Malaysia 81700, MY · Rupert-Mayer Straße 48, Munich, Bavaria 81379, DE · Bermann Miksa utca, Gyor, Győr-Moson-Sopron 9027, HU
Enabling the Digital World
ASMPT is the leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing. We are the only company in the world offering a comprehensive portfolio of integrated solutions for all major steps in electronics manufacturing. From bridging the gap between chip assembly and packaging to SMT, we help the world’s top manufacturers build the technology that powers everyday life. This is what we mean by enabling the digital world. Any device containing electronics has probably been developed or built using ASMPT's solutions. We are enabling the digital world. What We Do Our integrated solutions span the full electronics manufacturing value chain: • Semiconductor assembly and advanced packaging, including thermo-compression bonding, hybrid bonding, and multi-chip bonding • Surface mount technology (SMT) for high-precision electronics production and the Intelligent Factory • Manufacturing execution systems (MES) for smart factory operations From wafer-level processing to final chip assembly, our solutions and software are behind the critical components used in AI, automotive, high-performance computing (HPC), and 5G communications. Who We Work With We partner with leading IDMs, OSATs, and electronics manufacturers worldwide to deliver reliable, high-precision solutions that keep them at the forefront of innovation. Our Global Presence Founded in 1975 and headquartered in Singapore, ASMPT directly operates in over 30 countries and is represented with Sales and Service Locations in 52 countries, plus 15+ manufacturing and R&D centres across Asia, Europe, and the Americas. More than 10,600 employees drive our mission forward every day. We are listed on the Hong Kong Stock Exchange (HKEX: 0522). Our Commitment Innovation, People, and Sustainability sit at the core of everything we do. We are shaping a bright and sustainable future that creates lasting value for our customers, employees, investors, and society.
Offices: 2 Yishun Avenue 7, Singapore, Singapore 768924, SG · 18/F, Gateway ts, 8 Cheung Fai Road, Tsing Yi, New Territories, Tsing Yi , Hong Kong -, HK · PLO 534, Jalan Keluli 3, Kawasan Perindustrian Pasir Gudang, Pasir Gudang, Johor, Malaysia 81700, MY · Rupert-Mayer Straße 48, Munich, Bavaria 81379, DE · Bermann Miksa utca, Gyor, Győr-Moson-Sopron 9027, HU
