Air and Liquid Cooling Engineer

Key Responsibilities

1. System thermal design: Own the thermal architecture and design of server systems across air cooling (fans, heatsinks, air ducts and baffles) and liquid cooling (cold plates, manifolds, hoses and quick disconnects, CDU and facility-water interface).

2. Thermal requirements: Translate component specifications (CPU/GPU TDP and case temperature, memory, storage, NICs and optical modules) into system thermal budgets and design targets; specify fans, heatsinks and cold plates with suppliers.

3. Thermal control: Define fan-speed control and thermal protection logic (sensor selection and placement, control tables, throttling and fail-safe behavior) and work with BMC/firmware teams to implement and tune it, balancing component reliability, acoustics and fan power.

4. Analysis & validation: Use CFD and empirical testing to assess feasibility, optimize designs and validate products across the full operating envelope: ambient class and altitude, fan failure and redundancy, and coolant supply temperature and flow rate.

5. Liquid-cooling qualification: Characterize pressure drop, flow distribution and thermal resistance; drive leak testing and detection, coolant and wetted-material compatibility, and long-term reliability validation.

6. Design reviews & partners: Lead thermal design reviews with mechanical, electrical, power, firmware, acoustics and suppliers through each development phase; deliver risk assessments, mitigation plans and lessons learned.

7. Failure analysis: Lead root-cause analysis of thermal issues in development and in the field, define corrective actions and drive implementation with suppliers.

8. Technology & innovation: Evaluate and introduce new cooling technologies (e.g., advanced cold plates, two-phase or immersion cooling, vapor chambers, high-efficiency fans) and contribute invention disclosures and patents.

Key Qualifications

1. Bachelor's degree or above in Mechanical, Aerospace or a related engineering field, with a focus on heat transfer and fluid mechanics.

2. 5+ years of hands-on thermal design experience in electronic products; experience at a server/storage OEM or ODM, or a thermal solution supplier, is a strong plus.

3. Solid foundation in heat transfer, fluid mechanics and thermodynamics, plus working knowledge of thermal component manufacturing (heat pipes, vapor chambers, fin stacks, cold plates) and server system architecture.

4. Proficient with CFD tools (e.g., Simcenter Flotherm, Ansys Icepak/Fluent) and thermal test equipment and methods: airflow chamber/wind tunnel, liquid-cooling flow loop, thermal chamber, data acquisition and thermal test vehicles (TTVs).

5. Hands-on design experience in air cooling, liquid cooling, or both; candidates strong in one should be ready to build depth in the other.

6. Strong analytical skills; able to make and defend design trade-offs among thermal margin, acoustics, power, cost and serviceability with data.

7. Proven ability to drive results with cross-functional teams and suppliers; self-driven, detail-oriented and comfortable owning problems through to closure.

8. Good written and verbal English for working with global teams; able to travel to supplier and Lenovo sites as needed.

Preferred Qualifications

1. System- or rack-level liquid-cooling experience: cold plate and manifold design, quick disconnects, CDU integration, coolant chemistry and leak detection.

2. Experience developing fan control algorithms or BMC/firmware thermal tables.

3. Familiarity with ASHRAE TC 9.9 thermal guidelines, OCP cooling specifications