Jagiroad, Assam, India · On-site
Responsible for the technology and process development for the Flip Chip product packaging eg FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma C…
Skills: Flip Chip Packaging, Process Development, Back Grinding, Laser Groove, Mechanical Sawing
Narasapura, Karnataka, India · On-site
About Tata Electronics Tata Electronics is a prominent global player in the electronics manufacturing industry, with fast-emerging capabilities in Electronics Manufacturing Services, Semiconductor Assembly and Test, Semi…
Skills: Design for Manufacturability, Design for Assembly, SMT Assembly, PCB Manufacturing, IPC Standards
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The technician is responsible for the technology and process development of Flip Chip product packaging, covering the entire lifecycle from front-end to end-of-line processes. They will integrate customer requirements into cost-competitive DFM solutions while managing vendor discussions and process qualifications.
The role requires expertise in semiconductor packaging processes such as reflow, underfill, and singulation, along with the ability to manage equipment buy-offs and process controls. Candidates must be capable of executing multi-departmental projects and utilizing BKM data to optimize yield and quality.
Responsible for the technology and process development for the Flip Chip product packaging eg
FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill and
EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
Install, buy-off and qualify the given processes and products for development, NPI and LVM.
Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
Offer wide range of BOM selection to cater to different customer requirement.
Execution of multiple department projects.
Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
Assist in the MES, Automation of material, process and recipe controls.
Tata Electronics is a prominent global player in the electronics manufacturing industry, with fast-emerging capabilities in Electronics Manufacturing Services, Semiconductor Assembly and Test, Semiconductor Foundry, and Design Services. Established in 2020 as a greenfield venture of the Tata Group, the company aims to serve global customers through integrated offerings across a trusted electronics and semiconductor value chain.
Offices: Bengaluru , IN · Uddanapalli Village Shoolagiri Taluk Hosur, Krishnagiri District Tamil Nadu, 635119 , IN · No. 10, Jigani Industrial Area Jigani, Bangalore, Karnataka 560105, IN
Tata Electronics is a prominent global player in the electronics manufacturing industry, with fast-emerging capabilities in Electronics Manufacturing Services, Semiconductor Assembly and Test, Semiconductor Foundry, and Design Services. Established in 2020 as a greenfield venture of the Tata Group, the company aims to serve global customers through integrated offerings across a trusted electronics and semiconductor value chain.
Offices: Bengaluru , IN · Uddanapalli Village Shoolagiri Taluk Hosur, Krishnagiri District Tamil Nadu, 635119 , IN · No. 10, Jigani Industrial Area Jigani, Bangalore, Karnataka 560105, IN
