Staff Physical Design Engineer

Bangalore, India · Remote ok

About this role


Role Overview 

We are looking for a highly skilled Staff Physical Design Engineer to drive end-to-end physical implementation for advanced semiconductor designs across cutting-edge technology nodes. The ideal candidate will lead block/subsystem-level implementation activities, collaborate cross-functionally with RTL, STA, DFT, and CAD teams, and ensure high-quality tape-outs with strong focus on power, performance, and area (PPA). This role requires deep expertise in physical design methodologies, debugging complex issues, and mentoring junior engineers. 


What You’ll Do 

  • Lead full-chip or block-level physical design implementation from floorplanning to GDS signoff. 
  • Drive floorplanning, power planning, placement, CTS, routing, optimization, and physical verification closure. 
  • Analyze and optimize timing, congestion, IR drop, EM, and power for advanced technology nodes. 
  • Collaborate with RTL, DFT, STA, package, and CAD teams to resolve implementation and signoff challenges. 
  • Develop and improve physical design flows, automation scripts, and methodology enhancements. 
  • Support tape-out activities and ensure design signoff quality across all implementation stages. 
  • Mentor junior engineers and contribute to technical reviews and best practices. 

What We’re Looking For 

  • Bachelor’s or Master’s degree in Electronics, Electrical Engineering, VLSI, or related field. 
  • 8+ years of hands-on experience in ASIC/SOC physical design implementation. 
  • Strong expertise in industry-standard EDA tools such as Cadence Innovus, Synopsys ICC2, PrimeTime, and StarRC. 
  • Solid understanding of timing closure, low-power design techniques, signal integrity, IR/EM analysis, and physical verification. 
  • Experience working on advanced technology nodes (7nm/5nm/3nm preferred). 
  • Strong scripting skills in Tcl, Perl, or Python for automation and flow enhancement. 
  • Excellent debugging, problem-solving, communication, and stakeholder collaboration skills. 

Good to Have 

  • Experience with hierarchical and top-level SOC integration. 
  • Exposure to ML/AI-based design optimization methodologies. 
  • Knowledge of package-aware implementation and multi-die/chiplet architectures. 

Success in This Role Looks Like 

  • Consistent delivery of high-quality physical design milestones with minimal schedule impact. 
  • Successful closure of timing, power, area, and reliability metrics for complex SOC designs. 
  • Proactive identification and resolution of implementation bottlenecks and signoff risks. 
  • Positive contribution to team productivity, methodology improvements, and mentoring initiatives. 

Company at a glance

AI silicon doesn't fail on compute. It fails on the infrastructure around it — power delivery, connectivity, and memory that weren't designed for the scale, speed, and packaging requirements of modern AI systems.
TYLsemi builds the chiplet infrastructure layer that solves this. Purpose-built for XPUs and Networking. Standards-based. Designed to integrate directly into your silicon program — not adapted from something else.

We're hiring across the US and India. Come build what's missing.

https://www.tylsemi.ai/company/careers/

Founded2026
Team Size11-50 employees
WorkspaceRemote ok
IndustrySemiconductor Manufacturing
Location
Bengaluru, Karnataka, India
Websitetylsemi.ai
LinkedInLinkedIn

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