Principal Engineer – STA

Bangalore, India · Remote ok

About this role


Role Overview 

We are seeking a highly experienced Principal Engineer – STA to lead timing analysis and signoff activities for advanced ASIC/SOC designs. The role requires deep expertise in static timing analysis methodologies, timing closure strategies, and signoff convergence across complex multi-clock, multi-voltage, and high-performance designs. The ideal candidate will provide technical leadership, drive cross-functional collaboration, and enable successful tape-outs at advanced technology nodes. 1 


What You’ll Do 

  • Lead end-to-end STA and timing signoff activities for full-chip and subsystem-level designs. 
  • Drive timing closure across setup, hold, SI, noise, crosstalk, IR-aware timing, and MMMC scenarios. 
  • Define timing constraints, validate SDCs, and ensure robust timing methodology execution. 
  • Collaborate closely with RTL, Physical Design, DFT, CTS, and CAD teams to achieve timing convergence. 
  • Analyze and resolve complex timing violations and critical path bottlenecks. 
  • Support ECO implementation and signoff verification for advanced node tape-outs. 
  • Develop and improve automation flows, scripts, timing dashboards, and methodology enhancements. 
  • Mentor engineers and lead technical reviews for timing architecture and signoff readiness. 

What We’re Looking For 

  • Bachelor’s or Master’s degree in Electronics, Electrical Engineering, VLSI, or related field. 
  • 12+ years of experience in STA and timing signoff for ASIC/SOC programs. 
  • Strong expertise in setup/hold analysis, timing exceptions, CTS interaction, and timing convergence techniques. 
  • Hands-on experience with Synopsys PrimeTime, Tempus, StarRC, and related signoff tools. 
  • Strong understanding of SI, OCV/AOCV/POCV, CDC, low-power timing methodologies, and advanced node effects. 
  • Experience with advanced technology nodes such as 7nm, 5nm, or below. 
  • Strong scripting skills in Tcl, Python, Perl, or Shell scripting. 
  • Excellent technical leadership, debugging, communication, and stakeholder management skills. 

Good to Have 

  • Experience with package-aware timing analysis and chiplet architectures. 
  • Exposure to AI/ML-driven timing optimization methodologies. 
  • Familiarity with automotive or high-reliability SOC design standards. 

Success in This Role Looks Like 

  • Successful timing closure and signoff delivery for complex SOC tape-outs. 
  • Efficient management of timing convergence with minimal ECO impact. 
  • Improved STA methodology scalability, automation, and execution efficiency. 
  • Strong technical influence, mentoring contribution, and cross-functional leadership. 

Company at a glance

AI silicon doesn't fail on compute. It fails on the infrastructure around it — power delivery, connectivity, and memory that weren't designed for the scale, speed, and packaging requirements of modern AI systems.
TYLsemi builds the chiplet infrastructure layer that solves this. Purpose-built for XPUs and Networking. Standards-based. Designed to integrate directly into your silicon program — not adapted from something else.

We're hiring across the US and India. Come build what's missing.

https://www.tylsemi.ai/company/careers/

Founded2026
Team Size11-50 employees
WorkspaceRemote ok
IndustrySemiconductor Manufacturing
Location
Bengaluru, Karnataka, India
Websitetylsemi.ai
LinkedInLinkedIn

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