CAD Engineer
About this role
Job DetailsJob Location: Manila, AlabangKey Responsibilities and Duties
Bond shell and BD Drawing Support
Creates and maintains a directory of Bond shell and Build Diagrams for all Navitas products per assembly location
Prepares bond shell for all new packages being developed and to be stored in an assigned folder in the Directory. All revisions to the bond shell and description of change/s must be documented in the same folder.
Prepares single-unit drawing including per layer layout for routable leadframe technology
Generates a weekly report for all requests received including status and completion dates for each request.
3D Model Support
Creates the 3D model for thermal and thermomechanical simulations. Works with Packaging engineer to define the copper alloy and materials in the stacked in preparation for the thermal simulations.
Prepares 3D model for Preliminary and Final Datasheet of Navitas products
Package Outline Drawing Support
Creates and maintains separate directories of Package Outline drawings (POD) for Released Packages and Packages that are still under development. Manages drawing number assignment to differentiate between released and non-released packages
All corresponding changes to the POD must be captured in the revision history. Evidence on design reviews as part of the POD change must be stored in the same directory for future reference.
Aligns all package dimensioning requirement as per acceptable tolerances of a semiconductor component.
QualificationsRequired Qualifications
Bachelor’s degree in Engineering or a related technical field.
At least 5 years experience in semiconductor package drafting support
Apply GDT (Geometric dimensioning and tolerancing) in applicable drawings
Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.
Preferred Qualifications
Advance 2D/ 3D CAD skills (AutoCAD, Solidworks, etc)
Familiar with semiconductor package design rules.
Company at a glance
Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader in gallium nitride (GaN) and IC integrated devices, and high-voltage silicon carbide (SiC) technology, driving innovation across AI data centers, performance computing, energy and grid infrastructure, and industrial electrification. With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications. Navitas has over 300 patents issued or pending and is the world’s first semiconductor company to be CarbonNeutral®-certified.
Navitas Semiconductor, GaNFast, GaNSense, GaNSafe, GeneSiC, and the Navitas logo are trademarks or registered trademarks of Navitas Semiconductor Limited or affiliates. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.
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