Manage full lifecycle of PDE programs including planning, execution, monitoring, and closure. Define project missions, objectives, key deliverables, and resource requirements. Lead cross-functional teams across TD, HVM, CPI, DRAM, and NPI to ensure timely and quality delivery of strategic initiatives. Bachelor's or Master's degree in Engineering, Materials Science, or related technical field. 8+ years of experience in semiconductor packaging, process integration, or technology development. Proven track record in managing complex, cross-functional projects in a high-tech environment. Strong understanding of packaging flows including hybrid bonding, CoWoS, and chiplet integration. Excellent communication, leadership, and stakeholder management skills. Knowledge of simulation modeling, yield enhancement, and defectivity analysis. Develop and implement standardized PMO methodologies, tools, and templates. Ensure compliance with internal governance models and external customer requirements. Facilitate stakeholder communication across BU, PDT, TPM, and central engineering teams. Provide regular updates to leadership on project status, risks, and mitigation strategies. Develop and track KPIs for project success, yield reporting, and EOL accountability. Conduct project reviews to assess outcomes and identify lessons learned. Mentor project managers and promote continuous improvement across PMO practices.