Identify, diagnose and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Manage / audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Proven experience in engineering, particularly in the dry etch process with Masters/PhD Degree or Bachelors degree in Engineering fields with 5 years experience in semiconductor industry are preferred. Strong problem-solving skills and the ability to identify detailed solutions. Experience in process optimization and yield improvement initiatives. Familiarity with SPC, FDC, RMS, and APC systems. Ability to collaborate effectively with cross-functional teams. Excellent communication abilities and the skill to effectively guide projects to successful completion.