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Sr. Staff Engineer, Package Engineering
OTHERHsinchu

Summary

Location

Hsinchu

Type

OTHER

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About this role

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across cloud & AI, enterprise and carrier architectures, our innovative technology is enabling new possibilities.
The package engineering team drives semiconductor IC package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design and product. There is the excitement of always working on new projects and cutting-edge technologies.

What You Can Expect

  • NPI Package development, validation, qualification and production release.
  • Strategic alternative assembly and/or substrate sourcing development
  • Understand package requirements of various end-product applications and define the optimal IC package solution. Including the areas of high performance, cost effective, reliable and manufacturability.
  • Work closely with cross functional teams – such as sales & marketing, SI/PI, Mechanical & package design, QA, and product engineering teams. A key member of the NPI core team, in charge of all package related tasks, starting from IC package definition, sample delivery, package qualification and all the way to production ramp.
  • Manage and drive OSATs and substrate suppliers on package technical risk assessment, design review, BOM and process selection, package characterization and qualification.
  • Perform package design review.
  • Provide inputs to design guidelines and drive to implement the guidelines.
  • Achieve milestone dates for all NPI schedules.
  • Work with quality teams, OSAT/substrate suppliers to resolve package related quality/reliability issues.
  • Work with procurement and suppliers on the quotation and package cost analysis.

What We're Looking For

  • Bachelor’s degree in ME, MSE, EE, Physics, or related engineering fields and 5-10 years of related professional experience. Prefer Master’s degree and/or PhD in ME, MSE, EE or related engineering fields with 3-5 years of experience.
  • Experienced with flip-chip package development and substrate design review. Large FCBGA package experience is a plus. 
  • Deep understanding of semiconductor technologies, assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.  The ideal candidate would be knowledgeable of 2.5D, 3D and wafer-level packaging.
  • Basic Cadence APD and AutoCAD skills
  • Good communication skills that are essential to work well with internal cross functional teams and suppliers.
  • Good program and suppliers management skills.
  • Ability to work independently, provide leadership and to exercise discretion to solve complex problems.

Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Interview Integrity 

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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Other facts

Tech stack
Package Development,Validation,Qualification,Production Release,Cross Functional Collaboration,Design Review,Reliability Standards,Failure Analysis,Communication Skills,Program Management,Leadership,Problem Solving,Flip-Chip Package Development,Substrate Design,Semiconductor Technologies,Assembly Processes

About Marvell Technology

We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.

Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Team size: 5,001-10,000 employees
LinkedIn: Visit
Industry: Semiconductor Manufacturing
Founding Year: 1995

What you'll do

  • The role involves driving semiconductor IC package development from concept to mass production, focusing on New Product Introduction (NPI). The candidate will manage package-related tasks, including definition, qualification, and production ramp.

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Frequently Asked Questions

What does a Sr. Staff Engineer, Package Engineering do at Marvell Technology?

As a Sr. Staff Engineer, Package Engineering at Marvell Technology, you will: the role involves driving semiconductor IC package development from concept to mass production, focusing on New Product Introduction (NPI). The candidate will manage package-related tasks, including definition, qualification, and production ramp..

Why join Marvell Technology as a Sr. Staff Engineer, Package Engineering?

Marvell Technology is a leading Semiconductor Manufacturing company.

Is the Sr. Staff Engineer, Package Engineering position at Marvell Technology remote?

The Sr. Staff Engineer, Package Engineering position at Marvell Technology is based in Hsinchu, Taiwan. Contact the company through Clera for specific work arrangement details.

How do I apply for the Sr. Staff Engineer, Package Engineering position at Marvell Technology?

You can apply for the Sr. Staff Engineer, Package Engineering position at Marvell Technology directly through Clera. Click the "Apply Now" button above to start your application. Clera's AI-powered platform will help match your profile with this opportunity and guide you through the application process. You can also learn more about Marvell Technology on their website.