Job Summary

We are seeking a hands-on Senior Mechanical Engineer with strong expertise in electronics packaging and product realization to lead a small team of engineers in Melbourne, FL. The ideal candidate combines deep CAD/PLM proficiency (CREO and Windchill), practical prototyping experience, and proven ability to contribute to cost, schedule, and budget planning. This role will drive enclosure and thermal design for electronics systems, mentor and lead engineering staff, and shepherd designs from concept through prototype and production handoff.

What You Will Do

• Lead and mentor a group of mechanical and electro-mechanical engineers; set technical direction, assign tasks, and drive delivery of milestones.
• Architect and execute electronics packaging solutions: enclosures, board mounting, connectors, EMI/RFI mitigation, thermal management, cable routing, and mechanical interfaces.
• Create and revise detailed 3D CAD models and 2D drawings using CREO; enforce CAD best practices and design for manufacturability (DFM).
• Parametric modeling including MBD.
• Use Windchill for PLM tasks: maintain part structures, release engineering changes (ECOs/ECNs), manage BOMs, and ensure traceability.
• Develop prototypes — coordinate rapid prototyping, iterate hardware proofs-of-concept, and lead lab validation (fit, form, function, thermal, vibration, environmental).
• Provide input to program budgets, cost estimates, and schedule plans; track and report progress against cost and schedule targets.
• Collaborate cross-functionally with electrical engineering, manufacturing, test engineering, supply chain, and program management to meet product requirements.
• Define and maintain product requirements, risk assessments (DFMEA), and verification/validation plans for mechanical/electrical packaging.
• Support supplier selection, quote reviews, and supplier technical communications for tooling, sheet metal, injection molding, die castings, and cable assemblies.
• Drive continuous improvement through design reviews, lessons learned, and standardization of components and processes.

Required Qualifications

• BS or MS in Mechanical Engineering or a related field.
• Minimum 5 years of mechanical engineering experience with electronics packaging work.
• Proven experience leading and mentoring engineering teams.
• Proficient with CREO (solid modeling, assembly management, drawing generation, MBD).
• Practical experience with Windchill or similar PLM systems (release management, BOM control).
• Demonstrated hands-on prototyping experience (3D printing, CNC, sheet metal, rapid fabrication) and laboratory test familiarity.
• Strong understanding of thermal management, EMI/EMC practices, and mechanical tolerance stack-ups.
• Experience providing cost and schedule inputs and working with program management to meet program targets.
• Excellent communication skills, able to interact with technical and non-technical stakeholders.

Preferred Qualifications

• Experience with DFMEA, GD&T, and design for manufacturability for die case and machined metal parts.
• Prior exposure to manufacturing processes — injection molding, metal casting, NPI/tooling.
• Experience with electronic board-level mechanical constraints, standoffs, and mechanical connectors.
• Familiarity with regulatory and environmental standards (e.g., MIL-STD, UL, CE).
• Experience interfacing with contract manufacturers.
• Open Systems design experience (Com Express, VPX, VITA, MOSA, SOSA).
• Modular system design experience.

Competencies & Attributes

• Strong problem-solving and decision-making under schedule pressure.
• Proactive leader who fosters collaboration and knowledge sharing.
• Detail-oriented with a focus on robust, producible designs.
• Comfortable in fast-paced, iterative development cycles.