About this role
Your Role
Key responsibilities in your new role:
- Be responsible for Die Bond Unit Process Development (UPD) to qualify for high volume production of new assembly packages, build-of-material and wafer technologies
- Perform Die Attach Design of Experiment (DOE), evaluation, data gathering and lot monitoring
- Handle machine conversion / setup and buy-off according to quality requirements.
Your Profile
Qualifications and skills to help you succeed:
- Bachelor's / Master's Degree in Chemical, Electrical, Physics Engineering with minimum 7 years' experience in Die Bond process
- Knowledge on Glue / Epoxy interaction to Wafer backside metallization and Leadframe Finishing
- Die Attach Tooling Design knowledge
- Hands-on knowledge on ASM, ESEC and Datacon Die Bonders is an advantage
- Good proficiency in systematics & analytical skills.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Other facts
About Infineon
Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.
Together, with more than 58,000 people from over 100 countries, we are not just shaping the future. We are redefining it. We engineer innovative products, while caring for our people and empowering them to reach ambitious goals. We offer work-life balance, long term growth and a supportive environment where individuality is celebrated.
#WeAreIn for driving decarbonization and digitalization. Are you in?
What you'll do
- The role involves Die Bond Unit Process Development to qualify new assembly packages for high volume production. Responsibilities include performing design experiments, data evaluation, and ensuring machine setups meet quality standards.
Ready to join Infineon?
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