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Packaging Engineer
full-timeHsinchu

Summary

Location

Hsinchu

Type

full-time

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About this role



WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  




THE ROLE: 

We are looking for a candidate that can drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology! 

 

THE PERSON: 

The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder. 

 

KEY RESPONSIBILITIES: 

  • Drive for supplier engagement on new technology development and new capabilities ahead of need
  • Serves as technical interface for specific processes or modules at OSATs. Supports reviews, data analysis, and issue resolution with guidance
  • Supports substrate design reviews, understands stack-ups, line/space requirements, and basic warpage control
  • Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders  
  • Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio 
  • Prepare & present Executive Summary of projects and supplier’s performance 
  • Coordination of activities within/external team to deliver critical metrics 
  • Overseas travelling as required 

 

PREFERRED EXPERIENCE: 

  • Applies solid technical knowledge in packaging and substrate technologies to execute defined tasks and projects. Understands advanced packaging, and substrate fundamentals
  • Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage) 
  • Track record of development work leading to volume production in Packaging manufacturing 
  • Works effectively with design, reliability, quality, and supply chain teams on assigned tasks

 

ACADEMIC CREDENTIALS: 

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering 

 

  • #LI-SC1

#LI-HYBRID 




Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

 

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

 

This posting is for an existing vacancy.

Other facts

Tech stack
Supplier Engagement,Project Management,Conflict Management,Interpersonal Skills,Communication Skills,Leadership,Technical Knowledge,Packaging Technologies,Substrate Technologies,Flip Chip Packaging,Value Engineering,Data Analysis,Issue Resolution,Market Intelligence,New Product Introduction,Team Coordination

About Advanced Micro Devices, Inc

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_

Team size: 10,001+ employees
LinkedIn: Visit
Industry: Semiconductor Manufacturing
Founding Year: 1969

What you'll do

  • The role involves driving supplier engagement for new technology development and managing New Product Introduction activities with external manufacturing partners. The candidate will also coordinate market intelligence analysis to support AMD's product portfolio.

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Frequently Asked Questions

What does a Packaging Engineer do at Advanced Micro Devices, Inc?

As a Packaging Engineer at Advanced Micro Devices, Inc, you will: the role involves driving supplier engagement for new technology development and managing New Product Introduction activities with external manufacturing partners. The candidate will also coordinate market intelligence analysis to support AMD's product portfolio..

Why join Advanced Micro Devices, Inc as a Packaging Engineer?

Advanced Micro Devices, Inc is a leading Semiconductor Manufacturing company.

Is the Packaging Engineer position at Advanced Micro Devices, Inc remote?

The Packaging Engineer position at Advanced Micro Devices, Inc is based in Hsinchu, Taiwan. Contact the company through Clera for specific work arrangement details.

How do I apply for the Packaging Engineer position at Advanced Micro Devices, Inc?

You can apply for the Packaging Engineer position at Advanced Micro Devices, Inc directly through Clera. Click the "Apply Now" button above to start your application. Clera's AI-powered platform will help match your profile with this opportunity and guide you through the application process. You can also learn more about Advanced Micro Devices, Inc on their website.